In the News

Jan 2012

SEMATECH’s EMAs Prepare 3D Tools for HMV Readiness

(3DIncites)

Dec 2011

Fast Forward: Finding New Common Ground in Process Technology R&D (SEMI)

02 Nov 2011

3D chips: The next electronics revolution (COMPUTERWORLD)

05 Oct 2011

Predictive Techniques Take Stage at ISMI Symposium (Semiconductor Manufacturing and Design)

04 Oct 2011

Why it's time for a "refresh" (Electro IQ)

30 Sep 2011

Making EUV work, with a subsystem ear(Electro IQ)

12 Sep 2011

Extreme Exposure: EUV Seems to be Coming Around (Electronic Engineering Journal)

22 Aug 2011

EUV Mask Defects: What Can We Do About Them? (Semiconductor Manufacturing and Design

July 2011

Standardizing in an Increasingly 3D World (Future Fab International)

18 July 2011

Companies Join SEMATECH’s EMI Partnership (Semiconductor Manufacturing and Design)

13 July 2011

450mm update: Participation rising, patterning defined, “low risk” determined (Solid State Technology)

13 July 2011

EUV lithography infrastructure update from SEMATECH (Solid State Technology)

13 July 2011

Top semiconductor metrology challenges from SEMATECH POV (Solid State Technology)

May-June 2011

Partnering to Enable Volume Manufacturing for 3D IC Stacks with TSVs (Chip Scale Review)

24 May 2011

SEMATECH: A Model for Advancing Solar Technology (ENERGY.GOV)

01 April 2011

Surface preparation for 2011 and beyond (Solid State Technology)

01 April 2011

SEMATECH partners with RRAM startup (EETimes)

01 March 2011

If wide I/O DRAM and other 3D technologies can go HVM, standards are needed (Advanced Packaging)

01 March 2011

Scaling transistors: from new materials to new device architectures (Solid State Technology)

01 February 2011

The future of lithography (Solid State Technology)

01 January 2011

450mm, TSV, EUV transitions: What role does government play? (Solid State Technology)

14 December 2010

III-V MOSFET on 200mm Si fabbed using industry-standard tools: SEMATECH at IEDM (Solid State Technology)

01 December 2010

Bringing fabless players into manufacturing research (EDA Tech Forum)

01 December 2010

Exotic Transistors With Silicon Credentials (IEEE Spectrum)

04 October 2010

Lithography materials infrastructure benefits from a collaborative research approach (Solid State Tecnnology)

14 July 2010

450mm report: Standards, AMHS, platforms getting ready (Solid State Tecnnology)

13 July 2010

Workshop addresses simulating, measuring 3D IC stress using TSVs (Advanced Packaging)

22 June 2010

EUV lithography cannot come soon enough (EDN)

23 May 2010

Survey reveals EUV to be used for making chips in 2014 (EETimes)

23 April 2010

Stress Management for 3D ICs using TSVs (3D InCites)

01 March 2010

III-V MOSFETs: beyond silicon technology (Solid State Technology)

05 February 2010

Status of EUV lithography for the 22nm half-pitch (Solid State Technology)

05 February 2010

Dow Electronic Materials Joins SEMATECH’s Resist Materials and Development Center at UAlbany NanoCollege (Nano TechWire)