Hynix Semiconductor Joins SEMATECH’s 3D Interconnect Program at UAlbany NanoCollege
Collaborative effort to address critical infrastructure and technology gaps to drive wide I/O DRAM solution
Albany, NY and SEOUL, Korea (March 8, 2011) – Hynix Semiconductor Inc. (Hynix), a world-leading memory supplier offering dynamic random access memory chips (DRAMs) and flash memory chips, and SEMATECH today announced Hynix has become a member of SEMATECH’s 3D Interconnect program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.
Hynix will collaborate with engineers in SEMATECH’s 3D Interconnect program at CNSE’s Albany NanoTech Complex to address industry infrastructure and technology gaps in materials, equipment, integration and product-related issues for high-volume adoption of through-silicon-vias (TSV).
Volume implementation of wide input/output (I/O) memory-based products is gaining significant momentum in the industry. Worldwide academic and industrial research activities are currently focusing on developing new and improved technologies and the stacked wide I/O DRAM for mobile applications. Successful deployment of wide I/O and TSV combination will enable heterogeneous 3D integration and volume production of 3D-based products. Hynix and SEMATECH are uniquely positioned to address commercialization challenges and to lead the industry in enabling wide I/O interface structures using TSVs for high-volume manufacturing within the next two years.
“3D integration offers a path for higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction,” said Dr. Sung Joo Hong, head of R&D Division of Hynix Semiconductor. “By joining SEMATECH’s 3D Interconnect program and collaborating with industry-leading partners, we expect to play a critical role in accelerating the commercialization of wide I/O DRAM and to realizing 3D’s potential as a manufacturable and affordable path to sustaining semiconductor productivity growth.”
“The need for cooperation across the industry in order to achieve 2013 high volume manufacturing (HVM) for the wide I/O DRAM is critical for memory manufacturers,” said Raj Jammy, vice president of Emerging Technologies at SEMATECH. “We are excited by this opportunity to partner with a leading memory maker like Hynix. With such partnerships, SEMATECH’s leading-edge R&D capabilities and advanced 3D IC know-how will contribute to the growth of the semiconductor industry.”
“We are delighted to welcome Hynix Semiconductor to the growing ranks of global companies attracted by the SEMATECH-CNSE partnership to conduct leading-edge nanoelectronics research and development at the UAlbany NanoCollege,” said Richard Brilla, vice president for strategy, alliances and consortia at CNSE. “This will further build the state-of-the-art capabilities at CNSE’s Albany NanoTech Complex to enable the innovative technologies that are critical to serving the needs of industry.”
Through technology leadership and global collaboration, SEMATECH’s 3D Interconnect program emphasis is on exploring 3D technology options that provide cost-effective and reliable solutions to drive manufacturing readiness of 3D TSV.
About Hynix Semiconductor Inc.
Hynix Semiconductor Inc. (HSI) of Icheon, Korea, is the world’s top tier memory semiconductor supplier offering Dynamic Random Access Memory chips (DRAMs), Flash memory chips (NAND Flash) and CMOS Image Sensor (CIS) for a wide range of distinguished customers globally. The company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about Hynix is available at www.hynix.com
The UAlbany CNSE is the first college in the world dedicated to education, research, development, and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience, and nanoeconomics. CNSE’s Albany NanoTech Complex is the most advanced research enterprise of its kind at any university in the world. With over $7 billion in high-tech investments, the 800,000-square-foot complex attracts corporate partners from around the world and offers students a one-of-a-kind academic experience. The UAlbany NanoCollege houses the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 80,000 square feet of Class 1 capable cleanrooms. More than 2,500 scientists, researchers, engineers, students, and faculty work on site at CNSE’s Albany NanoTech, from companies including IBM, GlobalFoundries, SEMATECH, Toshiba, Samsung, Applied Materials, Tokyo Electron, ASML, Novellus Systems, Vistec Lithography and Atotech. An expansion currently in the planning stages is projected to increase the size of CNSE’s Albany NanoTech Complex to over 1,250,000 square feet of next-generation infrastructure housing over 105,000 square feet of Class 1 capable cleanrooms and more than 3,750 scientists, researchers and engineers from CNSE and global corporations. For more information, visit www.cnse.albany.edu.
For 20 years, SEMATECH, the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.