ALBANY, N.Y. (May 10, 2012) – SEMATECH announced today that Winbond Electronics Corporation has joined the International SEMATECH Manufacturing Initiative (ISMI) program based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. Winbond will join ISMI and its members to develop innovative manufacturing capabilities to solve common productivity, cost and cycle time challenges in semiconductor factories and equipment.
As a member of ISMI, Winbond Electronics will exchange real fab experiences and best practices to address common equipment and factory processing issues that will contribute to help chip manufacturers improve factory operations and equipment productivity and reduce cost per wafer.
“We look forward to working closely with Winbond in a collaborative effort to improve semiconductor manufacturing productivity and cost performance," said Richard Young, SEMATECH vice president of Manufacturing Technology. “Using technical innovation, action and commitment we can work together to find methods to improve manufacturing efficiencies.”
ISMI is working cooperatively with more than 20 other leading chipmaker and supplier members to develop innovative productivity solutions to improve equipment and factory performance for their semiconductor fabs. Additionally, ISMI provides industry leadership in sustainability and green initiatives through addressing regulatory challenges and resource conservation in manufacturing operations.
ISMI membership is open to all semiconductor manufacturers and suppliers. As a member-driven consortium, participating companies continuously evaluate and refresh ISMI’s program content, which includes cycle time reduction, equipment productivity improvement, fab benchmarking, green initiatives, regulatory impacts and resource conservation. In addition, ISMI and its members are collaborating with a broad network of companies, consortia, universities, national laboratories and associations from around the world on innovative manufacturing and ESH technology solutions.
Winbond Electronics Corporation (TSE:2344) is the Memory IC company of excellence. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, manufacturing, and sales services. Winbond owns three main business groups: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond’s product portfolio, consisting of Mobile RAM, Specialty DRAM, Graphics DRAM and low/medium-density NOR Flash, is widely used by leaders in the consumer, communication, computer peripheral and automobile markets. Based on a 300 mm wafer fab, Winbond keeps pace with the latest technologies to provide high-quality memory IC manufacturing services. Winbond headquarters in Central Taiwan Science Park, Taiwan, and also has subsidies in America, Japan and Hong Kong. For more information, please visit: http://www.winbond.com.