ALBANY, N.Y. and HORSHAM, P.A. (June 6, 2012) – Solid State Equipment LLC (SSEC), a manufacturer of single wafer wet processing equipment for the semiconductor industry, has joined SEMATECH's 3D Interconnect program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process and metrology solutions for readying high-volume via-mid through-silicon via (TSV) manufacturing.
The collaboration between SSEC and engineers in SEMATECH's 3D Interconnect program at CNSE's Albany NanoTech Complex will include evaluation and development of leading-edge wafer thinning and TSV wafer cleaning processes. Specifically, SEMATECH will utilize various SSEC process platforms for silicon etching, via reveal height metrology and wet cleaning.
"3D integration offers a path for higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction," said John Voltz, Director of Global Field Operations for SSEC. "By joining SEMATECH's 3D Interconnect program and collaborating with industry-leading partners, we expect to play a critical role in addressing industry infrastructure and technology gaps in equipment, integration and product related issues for high volume adoption of through-silicon vias."
"SEMATECH is constantly strengthening and growing our strategic network alliances with leading-edge equipment and materials suppliers," said Sitaram Arkalgud, director of SEMATECH's 3D interconnect program. "We are excited by this opportunity to partner with SSEC. Such partnerships coupled with SEMATECH's leading edge R&D capabilities for advanced 3D IC know-how will contribute to the growth of the semiconductor industry."
"The addition of Solid State Equipment LLC to CNSE's Albany NanoTech Complex further underscores Governor Andrew Cuomo's declaration that New York is open for business," said Richard Brilla, CNSE vice president for strategy, alliances and consortia. "We look forward to working with SSEC as part of the CNSE-SEMATECH partnership, which is playing a vital role in driving technological progress and economic development."
Through technology leadership and global collaboration, SEMATECH's 3D Interconnect program emphasis is on exploring 3D technology options that provide cost-effective and reliable solutions to drive manufacturing readiness of 3D TSV.
Founded in 1965 and headquartered in Horsham, Pennsylvania, Solid State Equipment LLC dba SSEC, is a leading manufacturer of single wafer wet processing equipment for the Advanced Packaging, Compound Semiconductor and Silicon Semiconductor Industries. Solid State Equipment maintains worldwide sales and technical service offices in Horsham, Pennsylvania; San Jose, California; Regensburg, Germany; Cramlington, England; Taiwan, R.O.C.; Shanghai, P.R.C; Woodlands, Singapore; Gyeonggi, R.O.K.; and Laguna, Philippines.