The idea is born. Prompted by several years of slipping U.S. semiconductor market share, the Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) hold a joint meeting in May and issue a call for cooperation to provide the U.S. semiconductor industry with the capability of regaining world-leadership in semiconductor manufacturing. In November the SIA board establishes a steering committee chaired by Charles Sporck to create a plan for a cooperative industry-government manufacturing venture.
Site proposals are invited and submitted, and SEMATECH is incorporated with 13 charter members. In December, Congress approves and President Reagan signs into law the first year of funding for SEMATECH.
Austin, Texas is selected as home to SEMATECH. Robert Noyce is named Chief Executive Officer. SEMATECH converts a warehouse into a class 1 clean room facility in just 32 weeks and dedicates the SEMATECH facility in November. SEMATECH initiates its University Centers of Excellence program in partnership with SRC.
SEMATECH produces its first wafer lot in March. The consortium initiates its first partnerships with national laboratories, Sandia National Laboratories and Oak Ridge National Laboratory. SEMATECH announces an agreement of cooperation with the Waco-based Texas State Technical Institute (TSTI) and the Center for Occupational Research and Development (CORD) to assist in the development of educational curricula in semiconductor manufacturing.
SEMATECH and the Joint European Submicron Silicon Initiative (JESSI) agree on their first collaborative projects. SEMATECH demonstrates capability to manufacture 0.5 micron circuitry using all American-made equipment. William J. Spencer accepts the post of Chief Executive Officer in October.
Robert Galvin of Motorola, Inc., is elected chairman of the board. The National Advisory Committee on Semiconductors (NACS) holds its Micro Tech 2000 Workshop, and the resulting report, which outlines a vision of products and processes required for the U.S. semiconductor industry, becomes a precursor for future semiconductor technology roadmaps. SEMATECH establishes a 200 mm Project Core Team and begins conversion of research facilities from 6-inch (150 mm) to 8-inch (200 mm) silicon wafers.
SEMATECH completes the conversion of its Advanced Tool Development Facility to 200 mm wafers in June. SIA's first National Technology Roadmap for Semiconductors Workshop is held in November. VLSI Research announces that U.S. semiconductor firms will account for 44 percent of worldwide semiconductor revenues in 1992 to lead the world in chip sales for the first time since 1984. SEMATECH demonstrates a 0.35-micron process flow on 200 mm wafers using all American-made equipment.
The first edition of the National Technology Roadmap for Semiconductors is published in March. To parallel technology areas identified in the Roadmap, SEMATECH's Board of Directors broadens the SEMATECH charter to include packaging, test, design, and materials technologies.
The National Technology Roadmap for Semiconductors is updated and published in November. SEMATECH participates in an international summit in Tokyo in November where agreement is reached on next-generation wafer size (300 mm).
SEMATECH's Board of Directors approves a new business model that positions the consortium to operate without federal funding. The first International Symposia on 193 nm technology is held to accelerate development of lithography technologies. The International 300 mm Initiative (I300I) is incorporated as a subsidiary of SEMATECH in November with both US and non-U.S. companies.
SEMATECH's Advanced Technology Development Facility produces its first 300 mm wafer. SEMATECH's Productivity Analysis group publishes tool requirements for 0.18-micron ICs on 200 mm wafers and 0.25-micron ICs on 300 mm wafers and 0.18 micron ICs on 300 mm wafers. Bill Spencer is elected chairman of the board in July replacing Robert Galvin who is named vice chairman. SEMATECH organizes the Partnering for Workforce Development program to establish semiconductor technology programs in community colleges throughout the U.S.
I300I and J300, the Japanese-led 300 mm development effort, sign the Global Joint Guidance Agreement to identify the 300 mm standards requirements of global device makers. SEMATECH announces the production of its first copper metalized wafers and the first integration of low-k dielectric insulating materials with copper metalization. SEMATECH hosts the Next-Generation Lithography Workshop involving experts from all over the world. Mark Melliar-Smith is elected chief executive officer, replacing Spencer who retires as CEO.
SEMATECH launches a new subsidiary, International SEMATECH, expanding the involvement of its non-US members in programs on 300 mm, lithography, ESH, and manufacturing methods. I300I completes thirty-two 300 mm tool demonstrations, and enters into an agreement with Selete to facilitate joint tool demonstrations and the sharing of results from 300 mm equipment evaluations. Front End Processes Research Center is established with the Semiconductor Research Corporation (SRC) and three universities to conduct fundamental research on materials and processes for sub-100 nm device technology.
The Industry Executive Forum (IEF) is established to promote open communication with global equipment supplier company executives on semiconductor industry challenges. Participants at International SEMATECH's Next Generation Lithography (NGL) workshop agree to continue development of two NGL technology options: EUV and EPL. International SEMATECH data aids the World Semiconductor Council's decision to reduce PFC emissions in the industry by ten percent worldwide.
In January, SEMATECH's name officially changes to International SEMATECH, reflecting a unified global consortium. International SEMATECH completes installation of the SVGL Micrascan 193 nm ArF Exposure System, one of the most advanced optical lithography scanners in the world. 157 nm exposure capability is established in the Resist Test Center (RTC) using an Exitech 157 nm Microstepper, the world's first F2 VUV laser processing system commercially available. The first images produced by a commercial resist supplier using the RTC Microstepper are achieved. The First International Symposium on 157 nm Lithography drives industry acceptance of the manufacturability of optical lithography to below the 100 nm technology node. OB Bilous is named chairman of International SEMATECH Board of Directors.
The e-Diagnostics program establishes key guidelines for the industry and announces expansion of program to include collaboration with Japanese consortia Selete and JEITA for global standards consensus. Bob Helms is named President and CEO of International SEMATECH.
Tokyo Electron becomes International SEMATECH’s first “supplier room” tenant. International SEMATECH wins the EPA’s prestigious Climate Protection Award. An industry effort is launched to define a single set of requirements and objective tests for certifying 300 mm equipment. International SEMATECH and The University at Albany-SUNY announce $320M strategic alliance to develop tool infrastructure for extreme ultraviolet (EUV) lithography. An ultra low-k dual damascene process is qualified on 300mm tools, enhancing 300mm processing capability.
International SEMATECH begins the year with the formal opening of its advanced EUV program at UAlbany. Dr. Michael R. Polcari, Vice President of Procurement Engineering for IBM Global Procurement, becomes the consortium's new President and CEO. The Lithography Division sponsors the semiconductor industry's second immersion workshop, where no significant barriers are found to implementing the potentially revolutionary technique. International SEMATECH technologists report breakthroughs in high-k processing and gate dielectric, low-k materials, and automated material handling. Gov. Rick Perry and the Texas Legislature approve funding for advanced materials research to be led by International SEMATECH and Texas universities. In November, International SEMATECH launches a new, wholly owned consortium—International SEMATECH Manufacturing Initiative (ISMI)—to help semiconductor manufacturers increase productivity and lower costs.
International SEMATECH holds industry-wide
meeting on Lithography; industry
representatives select 193 nm
immersion as the most likely candidate
for manufacturing for
State of Texas and International
SEMATECH announce the formation
of the Advanced Materials Research
Center (AMRC) with the University
of Texas (UT) System and other Texas
universities to investigate emerging
semiconductor technologies and help
ensure the state’s high-tech
SEMATECH and Exitech announce agreement
to develop the world’s first
ultra high numerical aperture (NA
= 1.3) 193 nm wavelength immersion
lithography tool. International
SEMATECH announces its latest subsidiary,
Advanced Technology Development Facility
(ATDF) as a for-profit research facility.
September of 2004, the parent company,
International SEMATECH, once again
SEMATECH achieves twin breakthroughs in channel mobility and reliability of high-k/metal gate transistors in preparation for 45 nm half pitch. Giang Dao from Intel promoted to vice president and chief operating officer for Advanced Technology at SEMATECH. Texas start-up companies Molecular Imprints, Zyvex, OrganicID, and Xidex, receive technological and financial assistance from the AMRC, a collaboration of the State of Texas, SEMATECH, and Texas research universities. ATDF selected by Acorn Technologies to fabricate its XMOS technology. SEMATECH's Immersion Technology Center receives key immersion lithography tool from Amphibian Systems. Samsung joins ISMI and later becomes a full member of SEMATECH. ISMI holds second manufacturing symposium discussing materials innovation, gigafabs, the future of Moore's Law and 450 mm wafers. ISMI identifies nearly $500 million in potential energy savings for industry fabs.