00053958A-XFR Abstract: Knowledge-Based Reliability Qualification Testing of Silicon Devices

SEMATECH DOC ID #: 00053958A-XFR

Title: Knowledge-Based Reliability Qualification Testing of Silicon Devices

Author(s): D. H. Eaton;N. Durrant;N. Lycoudes;R. Blish;S. J. Huber;

Document date: 05/31/2000

Descriptor(s): reliability testing;failure testing;failure mechanisms;

Abstract: Present day reliability qualification testing consists of a combination of
stress-based testing and failure mode or knowledge-based testing. Each has
advantages and disadvantages. Effectively using a knowledge-based
qualification testing approach requires considerable knowledge of the failure
mechanism, its acceleration model and how to detect the particular failure
mechanism as well as knowledge of the worst-case use conditions. In the
realm of semiconductor device physics a knowledge-based approach has been
used for many years in such areas as electromigration, hot carrier
degradation, and gate oxide integrity. The approach is less mature in the
area of semiconductor packaging for a variety of reasons. This paper
describes the differences between stress-based and knowledge-based testing
and the advantages and disadvantages of each. It also describes the
information necessary to apply knowledge-based testing more broadly to
semiconductor device and package reliability qualification.

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