SEMATECH DOC ID #: 97053286A-TR

Title: Cryogenic CO2 Parts Cleaning Technology (ESHCOO1): Final Report

Author(s): Joseph Rauschut;

Document date: 05/23/1997

Descriptor(s): dry cleaning;wafer cleaning;safety;cost analysis;secondary ion mass spectroscopy;

Abstract:  This document reports the results of a project to measure the performance of
a cryogenic CO2 technology using solid CO2 pellets at high velocities to
clean parts contaminated during semiconductor processing. Unlike traditional
manual cleaning methods, the cryogenic CO2 technology reduces the use of
solvents and acids as well as the clean time, operating costs, and worker
exposure to harmful chemicals. A secondary ion mass spectrometer (SIMS) was
used to investigate contamination related to the use of dry ice pellets,
block dry ice, and air. Because glycol is sometimes added to dry ice during
formation, the effects of glycol-containing and glycol-free dry ice also were
investigated. Costs associated with the cryogenic CO2 parts cleaning were
compared to the costs associated with manual cleaning on a part-by-part
basis.

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