99083813A-XFR Abstract: Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages

SEMATECH DOC ID #: 99083813A-XFR

Title: Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages

Author(s): Noel Durrant;

Document date: 08/20/1999

Descriptor(s): ball grid array packages;customer satisfaction;reliability testing;

Abstract: Increased package performance expectations, new packaging materials, and
market segmentation are key trends in today's semiconductor industry. The
SEMATECH Reliability Technology Advisory Board has developed a reliability
test methodology to keep pace with these market trends. Based on that
methodolgy, the SEMATECH Qualification, Monitors and Controls Team has
produced this paper, which provides an example of how to apply the method to
ball grid array (BGA) packages. An example of the use conditions qualification
methodology is presented in detail. The methodology is briefly defined and
input requirements are listed. Accelerated test conditions are developed,
based on knowledge of the customers' use conditions, activation energies, and
failure models. Test conditions that produce statistically justifiable failure
populations that are not likely to occur in the defined use environments are
minimized or eliminated. Examples of legacy test conditions from several
companies are provided for comparison.

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