SEMATECH DOC ID #: 00124038A-XFR

Title: Signature Failure Analysis-Based Methodology for Customer Failure Analysis

Author(s): Dan Rubens;Donat Renaud;Greg Wolfe;John Drummond;Len Gibbons;Noel Durrant;Roger Newkirk;Tam Le;

Document date: 12/08/2000

Descriptor(s): failure analysis;manufacturing;

Abstract:  This document proposes the implantation of Signature Failure Analysis (SFA)
methodology to analyze semiconductor failures. The SFA methodology groups
failure modes, based on initial analysis results, over the product's
lifetime. It then compares new failures to established data and suggests
corrective action for the most prevalent failures. This methodology has been
effectively demonstrated in the semiconductor industry.

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