SEMATECH DOC ID #: 02054267A-ENG

Title: Wafer Probe Roadmap: Guidance for Wafer Probe R&D Resources - 2002 Edition

Author(s): Fred Taber;Gavin Gibson;Jim Ammenheuser;

Document date: 05/17/2002

Descriptor(s): benchmarking;electrical test;probes;parametric test;

Abstract:  This document from the Wafer Probe Benchmarking project (MFGM007)
provides a wafer probe technology roadmap for 2002 through 2005.
It is an update and expansion of Technology Transfer #96073155A-TR,
SEMATECH Advanced Probe Technology (APT) Specification. This
roadmap document explains the data and direction of key wafer
probing-related parameters compiled from data collected by the
six probe project member companies from their internal roadmaps.
The roadmap is organized into three sections: Product-Driven
Requirements, Wafer Probe Technology Requirements (independent of
product type), and Wafer Probe Operations Requirements
(selection/procurement/use of probes). The appendix contains an
excerpt from the 2001 International Technology Roadmap for
Semiconductors (ITRS) that summarizes complex and immediate
challenges for wafer probing.