SEMATECH DOC ID #: 92031014A-GEN

Title: Guidelines for Equipment Reliability

Author(s): Vallabh Dhudshia;

Document date: 05/07/1992

Descriptor(s): RAMP;cost of ownership;equipment reliability;failure analysis;failure testing;

Abstract:  This guideline was developed by a task force comprised of reliability experts
and users of reliability methodologies from the SEMI/SEMATECH member
companies. It was delivered as a SETEC report (#91-025). The document was
written to address the needs of semiconductor equipment manufacturers and
their customers. It includes a description of the principles of a
cost-effective reliability program, instructions on how to get started, and
details on what needs to be done. A large portion of the document is
dedicated to analysis and testing methodologies. These include: Failure
Modes and Effects Analysis (FMEA), Fault Tree Analysis (FTA), Component
Failure Analysis (CFA), Human Reliability Analysis (HRA); and Reliability
Testing, Component Testing, Accelerated Testing (Sudden Death, Step-Stress
Testing), Burn-in Testing, Life Testing, Environmental Stress Screening,
Qualification Testing, and Acceptance Testing.