SEMATECH DOC ID #: 96103188A-ENG

Title: Software Process Improvement (SPI) Guidelines for Improving Software: Release 5.0

Author(s): Ted Ziehe;

Document date: 10/31/1996

Descriptor(s): equipment;equipment reliability;project management;quality management;software development;software development life cycle;Software Process Improvement;software reliability;suppliers;

Abstract:  This document provides semiconductor manufacturers and equipment suppliers
with a proactive, cooperative, and preemptive method for improving the
reliability and overall quality of software in fabs and process tools. This
approach is being developed and implemented by SEMATECH member companies and
their suppliers, coordinated by SEMATECH's Software Process Improvement (SPI)
Project. The method advocates four basic elements: a management policy to
support and measure software quality; functions to produce high-quality
software on time and within budget; stages for building quality-enhancing
functions into a software process; and partnering to facilitate and expedite
organizational change to improve software quality. This SEMATECH-coordinated
program is based on the Capability Maturity Model (CMM) from the Software
Engineering Institute (SEI). This document supplements, but does not replace,
Software Process Improvement (SPI) Guidelines for Improving Software: Release
4.0, Technology Transfer #95082943A-ENG.

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