|Document #||Document Name||Publication Date|
|40255||SEMATECH SECS Equipment Data Dictionary Guidance V0.9||11/25/2013|
|39933||Wait Time Waste (WTW) Metrics and Methods Guidance v1.0||05/21/2013|
|38927||Wait Time Waste STEP July 2012||07/19/2012|
|08094955A-ENG||Non-Product Wafer (NPW) Tracking Guidelines||09/25/2008|
|08074942A-ENG||International SEMATECH Manufacturing Initiative (ISMI) Equipment Change Notification Method: Version 1||07/28/2008|
|04034510A-TR||Comparing the Effectiveness of Stress-based Reliability Qualification Stress Conditions||04/12/2004|
|03044391A-ENG||Equipment Lockout/Tagout (LOTO) Capability Improvement||04/24/2003|
|00124038A-XFR||Signature Failure Analysis-Based Methodology for Customer Failure Analysis||12/08/2000|
|95032745A-GEN||Semiconductor Manufacturing Productivity Overall Equipment Effectiveness (OEE) Guidebook Revision 1.0||04/20/1995|
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