AEC/APC Symposium-Asia
November 27-28, 2008
Hsin Chu, Taiwan

Scope

The Semiconductor Industry has undergone drastic transformation in recent years. This has been driven by the sudden expansion of manufacturing capacities worldwide in 300mm wafers, and also by the rapid evolution of manufacturing capabilities. These transformations span full-scale functional integrations from shop-floors up to top-level corporate operations.

This transformation is in constant acceleration and accompanies the stringent technological requirements of ever-shrinking device dimensions required to meet the unquenchable thirst of human demands on all digital inventions, large or small. The very large investment in each 300-mm wafer fabrication factory creates a huge financial burden. At the same time, factories must cut operating costs and reduce cycle-time while remaining flexible in order to respond immediately to market changes.

With all the prevailing notions of supply/engineering/value chains and many others, e-Manufacturing has been identified to unify the synchronized integration as a critical link. The AEC/APC Symposium-Asia will review recent technological advancements to assure alignment with the needs of integrated circuit manufacturers, semiconductor equipment suppliers, software suppliers, sensors and metrology suppliers. Major issues and experiences on AEC/APC/e-Manufacturing/DFM will be discussed in this two-day event, which also includes a technical tutorial and supplier exhibition.

This Symposium offers a public arena for the exchange of up-to-date experiences among Asian manufacturers for adoption of recent technological developments.

AEC/APC proceedings available on CD-ROM

If you would like to order copies of previous AEC/APC Symposia proceedings on CD-ROM, please print and complete the proceedings order form and fax or mail it to SEMATECH according to the directions on the form. Proceedings from previous AEC/APC Symposium North America are also available.

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