This year's Symposium will be held at the Cliff Lodge at Snowbird, located in the heart of Utah's Wasatch-Cache National Forest in Little Cottonwood Canyon.
Find out more about Snowbird.
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History of the AEC/APC Symposium
From its inception in the early 1990’s as an informal data exchange among SEMATECH member companies to a industry-wide event spanning three continents, the AEC/APC Symposium has evolved into one of SEMATECH’s best known “signature” meetings, successfully aligning chipmakers, equipment suppliers, and software, sensor, and metrology suppliers in developing effective data-driven manufacturing solutions for factory productivity improvement.
Find out more about the why this meeting has become one of the premier events for chip manufacturing productivity experts worldwide. |
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Make your plans now to attend AEC/APC Symposium XX
Mark your calendars now for AEC/APC Symposium XX, North America's only symposium entirely dedicated to achieving efficient and intelligent manufacturing through data-driven, automated decision making. This year's Symposium will be held October 4-8 at the Cliff Lodge at Snowbird near Salt Lake City, Utah. We look forward to seeing you there!
AEC/APC proceedings available
If you would like to order copies AEC/APC Symposia proceedings, please print and complete the proceedings order form and fax or mail it to SEMATECH according to the directions on the form. Proceedings from AEC/APC Symposium Asia are also available.
Join our contact list
We welcome you to add yourself to our contact list in order to receive information about future AEC/APC Symposium activities and events. All contact information you provide will be used strictly for AEC/APC-related events and will not be disclosed in any other way. Please note: This form can also be used to help us update our records. If your contact information has changed, please let us know!
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As an AEC/APC Symposium sponsor, your logo will be prominently displayed here on the Home Page of the AEC/APC Symposium website, in the proceedings, and in many of our other printed materials.
For more information, see Sponsorship Opportunities. |
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