Advanced Metallization Conference 2010
October 5-7, 2010
College of Nanoscale Science and Engineering
257 Fuller Road
Albany, NY 12203
This conference—jointly sponsored by SEMATECH and the College of Nanoscale Science and Engineering of the University at Albany—is the 27th in a series devoted to leading-edge research in the field of advanced metallization and 3-D integration for ULSI IC applications.
As the industry continues to develop next-generation nanoscale interconnects, incorporating novel ultra low-k materials, ultra-thin barrier and capping layers, and continuously looking for significant performance improvements without sacrificing reliability is critical.
The objective of this conference is to provide a forum for open discussion of the important issues affecting state-of-the-art and future directions in interconnect systems.
Topics include both fundamental and applied research, as well as advanced interconnect materials issues, introduction to manufacturing, unit process development, full integration data, interconnect reliability, and IC wiring scaling.
Copper interconnect technology will also continue to be a major thrust for the Advanced Metallization Conference. Successful fabrication of copper interconnects is challenging and necessitates that the industry adopt novel technologies and develop innovative solutions to metallization issues.
Conference Updates
- See who's speaking at the AMC
- Conference sponsorship opportunities are now available.
- Find out about the publication of papers by Microelectronics Engineering
- Abstracts for this conference are currently being accepted. See the Call for Papers for details.
- Online conference registration is now open. Space is limited, so register early.
- See Exhibits for information about vendor displays, sponsorship, and presentation arrangements at the AMC
- In association with the U.S. session, an Asian session of this conference will be held October 20-22, 2010 in Tokyo, Japan. See www.admeta.org for details.
