SEMATECH Surface Preparation and Cleaning Conference
Surface Preparation and Cleaning Training Course
“Surface Conditioning: Fundamentals and Applications”
21 March 2011
8:00 AM - 4:15 PM
This full-day training course is divided up into two sessions:
The morning session provides a working knowledge of surface conditioning and cleaning techniques and the equipment used for the manufacture of integrated circuits. Surface and colloidal aspects of cleaning will be discussed, as well as chemistry of cleaning and etching, and surface phenomena of rinsing and drying.
The afternoon sessions consist of two parallel tracks: BEOL and FEOL cleaning technology. These sessions will address some of the more advanced surface prep and cleaning issues and solutions, such as high-k/metal gate cleaning, aluminum post-etch cleaning. high-dose implant stripping. minimal damage particle removal, and Si and Ge passivated surfaces.
Course Materials
Registered course attendees will receive the new edition of the Handbook of Cleaning for Semiconductor Manufacturing (eds., Karen Reinhardt and
Who Should Attend
This course is intended for engineers and managers using or supplying cleaning, surface conditioning, and contamination-free technologies for IC manufacturing.
Registration Details
| Course Registration Fees | on or before 08 March | after 08 March |
|---|---|---|
| Professionals | $575 USD | $ 675 USD |
| Students | $350 USD | $ 450 USD |
Registration Forms (select one):
Course Outline
Morning (Joint) Session:
- Course Overview
- Surface and Colloidal Aspects of Cleaning
- Chemistry of Cleaning
- Chemistry of Etching
- Surface Phenomena of Rinsing and Drying
Afternoon (Parallel) Sessions (attendees must chose one track):
BEOL
- Aluminum Post-etch Cleaning
- Cu and Low-k Post-etch Cleaning
- Copper Passivated Surfaces
- Cleaning of High Aspect Ratio Features
FEOL
- High-k/Metal Gate Cleaning
- High Dose Implant Stripping
- Minimal Damage Particle Removal
- Si and Ge Passivated Surfaces
Instructors and Contributors
Karen A. Reinhardt is the managing instructor for the course and editor of the Handbook of Cleaning for Semiconductor Manufacturing. She is Principle Consultant at Cameo Consulting in San Jose, California, working with companies developing cleaning and surface conditioning technologies for the IC industry. Prior to forming a consulting company, Karen was employed at Novellus Systems in San Jose, California. In this role she was responsible for investigating and assessing new and unique cleaning technologies that will allow realization of the ITRS roadmap with respect to smaller geometries, new materials, and the environmental issues associated with current cleaning processes. Karen has published over 30 technical papers ranging from plasma processing to damage characterization and cleaning technology assessment. She has been awarded seven patents.
Richard (Rick) F. Reidy is Associate Professor, Materials Science and Engineering Department, University of North Texas. He is co-editor of the Handbook of Cleaning for Semiconductor Manufacturing. Rick received his B.A. in Chemistry and Biochemistry from Rice University and his M.S. and Ph.D. in Metals Science and Engineering from Pennsylvania State University. His current research involves the development, characterization, and processing of interconnect materials, specifically, and low-k films. His group studies the effects of plasma and wet processes on low-k and the use of supercritical fluids to clean and repair processing-related damage to these materials. Rick has published over 50 scientific papers and given 10 invited presentations on low-k films at international conferences. Rick will be presenting on low-k damage and repair including pore sealing.
