Presentations |
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| Applications for TSV and Issues for Adoption | E. Jan Vardaman, TechSearch International Inc. |
| Challenges and Opportunities for Exploiting 3D Technology in System Designs | Dr. John U. Knickerbocker, IBM Corporation |
| Reliability of TSV Technology | E. Kaulfersch, Fraunhofer ENAS |
| 3D Through Silicon Stacking for Mobile/Wireless Markets - Gaps and Challenges | Matt Nowak, Qualcomm |
| 3D-IC Fabrication Challenges for More Than Moore Applications | Peter Ramm, Fraunhofer IZM |
| MEMS Sensor/IC Integration for Miniaturized TPMS (e-CUBES) | Maaike. M.V. Taklo, Sintef |
| A Novel Approach to TSV Metallization based on Electrografted Copper Nucleation Layers |
Claudio Truzzi, Alchimer |
| Electroplating aspects in 3D IC Technology | Albrecht Uhlig, Atotech |
| TSV Processing and Wafer Stacking | Kathy Cook, Suss MicroTech |
| Die Cavity Integration Technology for Through-Silicon-Vias Stacking | Katsuyuki Sakuma, IBM Corporation |
| Thermal and Stress Analysis Modeling for 3D Memory over Processor Stacks | John McDonald, RPI |
| Thermo-Mechanical Analysis of Through Silicon Vias in 3D Integration |
Gary K.H. Lu, University of Texas |
| Through Silicon Vias (TSV): Physical Design and Reliability | Sergy Savastiouk, AllVia |
Posters |
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| High-speed Copper Filling for 3D Packaging in Wafer Level | Mizuki Nagai, Ebara Corporation |
| Low Cost Solutions to Challenges in Commercialization of Through-Silicon Via 3D Integration |
Alex Wang, Tango Systems |
| A New CVD Copper Process for TSV Metallization | John Norman, Air Products |
| Issues Involved in Etching Through Silicon Vias at High Rate for Reliable Interconnects | Leslie Lea, Surface Technology Systems |
| Failure Mechanisms of Wafer Bonding | Thorsten Matthias, EVG |
| Processing of Thin Wafers using a Carrier wafer and Temporary Bonding and Debonding |
Thorsten Matthias, EVG |
| Remote Cold Dry Etching: Pre-Assembly Processes for Ultra-Thin Chips | Peter Heinze, PVA-Tepla |
| Modifying Bosch etch process for improved CoO |
Brad Eaton, Applied Materials |