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3D Interconnect

9-11 October 2012 Advanced Metallization Conference (order)
09 Nov 2012 Underfill Challenges for 3D Interconnect (order)
11 Jul 2012 SEMATECH Workshop on 3D Interconnect Metrology
10 Jul 2012 ESD Challenges for 3D ICs (order)
4-6 October 2011 Advanced Metallization Conference (order)
9 Sep 2011 SEMICON Taiwan 3DS-IC Temporary Bonding Technology Workshop (order)
14 Jul 2011 SEMATECH Workshop on Stress Management for 3D ICs using Through Silicon Vias
13 Jul 2011 SEMATECH Workshop on 3D Interconnect Metrology
11 Jul 2011 Enabling 3D: Temporary Bonding Workshop
17 Mar 2011 Design for Reliability Workshop
5-7 October 2010 Advanced Metallization Conference
14 Jul 2010 SEMATECH Workshop on 3D Interconnect Metrology
13 Jul 2010 2nd SEMATECH Workshop on Stress Management for 3D ICs using Through Silicon Vias
16 Mar 2010 SEMATECH Workshop on Stress Management for 3D ICs using Through Silicon Vias
15 Jul 2009 SEMATECH Workshop on 3D Interconnect Metrology
13 Nov 2008 Design and Test Challenges for 3D ICs
25-26 Sep 2008 Manufacturing and Reliability Challenges for 3D ICs using TSVs
16 Jul 2008 Equipment Challenges for 3D Interconnect
11-12 Oct 2007 Thermal and Design Issues in 3D ICs