Exposure tools and immersion lithography |
| Nikon F2 Exposure Tool |
Soichi Owa, Nikon Corporation |
| Development of 157nm Exposure Tools |
Hideo Hata, Canon Inc. |
| 157nm Exposure Tool |
Hans Jasper, ASML |
| Update on MSVII Lithographic System |
J. McClay, ASML |
| Drivers, Prospects and Challenges for Immersion Lithography |
Burn J. Lin, TSMC |
| Immersion Lithography: Optics for the 50nm Node |
M. Switkes, MIT Lincoln Laboratory |
| 157nm Objective Improvements, Wavefront Measurements and Modeling Predictions |
James Webb, Corning Tropel Corporation |
| High Numerical Aperture Lens for 157nm Lithography |
Toshifumi Suganaga, Selete |
Materials |
| Calcium Fluoride Quality Improvement Will Enable High Volume F2 Lithography Tools |
G. Grabosch, Schott Lithotec AG |
| Progress in the Development of CaF2 Materials for 157nm Lithography Applications |
Bill Rosch, Corning Inc. |
| Crystal Growth of CaF2 – Focus on Yield Enhancement |
N. Senguttuvan, Hitachi Chemical Co., Ltd. |
| CaF2 Ramp Challenges for 157nm Lithography |
Janice M. Golda, Intel Corporation |
| Index- and Birefringence-Dispersion Properties of CaF2, SrF2 and Ca1-xSrxF2 down to 157nm |
John H. Burnett, NIST |
| Modified Fused Silica Glass “AQF” for 157 nm Lithography |
Y. Ikuta, Asahi Glass Co. Ltd. |
| Refractory Oxide Contamination of Optical Surfaces at 157 nm |
T.M. Bloomstein, MIT Lincoln Laboratory |
| Long-Term Durability of Optical Coatings |
V. Liberman, MIT Lincoln Laboratory |
| Accelerated Damage to CaF2 and MgF2 Surfaces |
V. Liberman, MIT Lincoln Laboratory |
Lasers |
| High Power, High Repetition Rate F2-Laser for 157 nm Lithography |
S. Spratte, Lambda Physik AG |
| F2 MOPA. Some Aspects of Spectral Purity |
German Rylov, Cymer Inc. |
| Spectral Dynamics Analysis of Ultra-Line-Narrowed F2 Laser |
Ryoichi Nohdomi Gigaphoton Inc. |
Resists |
| Recent Advancements in 157nm Resist Performance |
Karen Turnquest, AMD/SEMATECH |
| Performances of Fluoropolymer Resists for 157-nm Lithography |
Seiichi Ishikawa, Selete |
| Intel 157 nm Resist Benchmarking |
Jeanette Roberts, Intel Corporation |
| Advances in Fluorinated Polymers for 157nm Lithography |
Will Conley. SEMATECH |
| Fluoropolymer Resists for Single Layer 157 nm Lithography: Optimization of Their Combined Properties |
M. K. Crawford, DuPont |
| Process and Formulation Development of Dissolution Inhibitors for 157 nm Microlithography: A Progress Report |
Charles Chambers, University of Texas |
| Angle Resolved Scattering Measurements at 157nm |
T.M. Bloomstein, MIT Lincoln Laboratory |
| VUV Spectroscopic Ellipsometry Studies of Key Substrate Materials for 157nm Lithography |
N.V. Edwards, Motorola |
| Automated Metrology System Combining VUV Spectroscopic Ellipsometry and Grazing X-Ray Reflectance for the Characterization of Thin Films and Multilayers of 157nm Lithography |
Pierre Boher, SOPRA |
| Exicor Duv Birefringence Measurement System At Optical Lithography Wavelengths |
B. Wang, Hinds Instruments, Inc. |
| High Brightness F2* (157nm) and ArF* (193nm) Lamps |
Manfred Salvermoser, Rutgers University |
| Resist Contamination Issues at 157nm |
Kim Dean, SEMATECH |
| Evolution of Low Absorbance 157nm Fluoresists |
Gary Taylor, Shipley Co |
| Development of Silsesquioxane Based 157nm Photoresist: an Update |
Raymond J. Hung, JSR Microelectronics Inc. |
| Platform Considerations for 157 nm Photoresists |
Ralph R. Dammel, AZ Electronic Materials |
| Pragmatic Approaches to 157nm Resist Design |
Sanjay Malik, Arch Chemicals, Inc. |
Masks |
| Electron Beam Induced Processes and their Applicability to Mask Repair |
Johannes Bihr, LEO Elektronenmikroskopie GmbH |
| Development of Bilayered TaSiOx Embedded Attenuating PSM |
Toshiaki Motonaga, Dai Nippon Printing Co. Ltd. |
| 157nm Attenuated PSM Films by Ion Beam Sputter Deposition |
Matthew Lassiter, Photronics Inc. |
| Implementation Challenges of Fused Silica Pellicles for 157-nm Lithography |
Andrew Grenville, SEMATECH/Intel Corporation |
| Feasibility of Defect Inspection of 157nm Reticles Through Thick Pellicles |
Jim Wiley, KLA Tencor Corporation |
| Fused Silica Pellicle Mounting Issues |
Chris Van Peski, SEMATECH |
| Improvement of the Membrane Durability of Polymeric Pellicles |
Ikuo Matsukura, ASAHI Glass Co. Ltd. |
Cost of Ownership |
| An Analysis of 157nm Technology Cost of Ownership |
Walt Trybula, International SEMATECH |
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| Closing Remarks |
Luc Van den hove, IMEC |