(All presentations are in .PDF format)
| Keynote: Industry Consensus and SEMATECH Technology Direction | Giang Dao |
| 2005 Updates to the Lithography Chapter of the ITRS | Scott Hector |
Session 1 - EUVL |
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| Introduction | Janice Golda |
| SEMATECH and Other Consortia EUV Programs | Stefan Wurm |
| ASML EUV Alpha Demo Tool Development and Status | John Zimmerman |
| Nikon EUVL Tool Development Progress Summary | Takaharu Miura |
| EUV Source Development Progress | Joseph Pankert |
| EUV Optics Contamination | Iwao Nishiyama |
| Resist Development Status for EUVL | Hiroto Yukawa |
| EUV Reticle Handling | Kevin Orvek |
| EUV Mask Blank Development | Dave Krick |
| EUV Mask Patterning | Jan Hendrik Peters |
| EUV Extensibility | Russell Hudyma |
Session 2 - 193i Lithography |
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| Introduction | David Medeiros |
| Extensions of Wafer-Based ArF Immersion Lithography: High(er) NA & Multiple Exposure Processes | Matt Colburn |
| ASML ArF Immersion Tool Development and Status | Bill Arnold |
| ArF Immersion and Extension | Masaomi Kameyama |
| 193nm Immersion Lithography for 45nm and Beyond | Akiyoshi Suzuki |
| Managing RET Complexity Under Immersion | Frank Schellenberg |
| Mask Fabrication Challenges | Christophe Pierrat |
Session 3 - 193i+ |
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| Life Beyond Water | Will Conley |
| Beyond Water Process Capability | Shane Palmer |
| Resolution Limitations in Chemically Amplified Resists | Grant Willson |
| Second Generation Fluids for 193nm Immersion Lithography | Roger French |
| Outlook for Potential Third Generation Immersion Fluids | Juan López Gejo |
| High Index Optical Materials | John Burnett |
| Schott Lithotec Update on High Index Lens Materials | Lutz Parthier |
| High Index Fluoride Single Crystal | Yoji Inui |
| High Index Resists | Andrew Whittaker |
Session 4 - Electron Projection Lithography |
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| Status of EPL Technology | Hiroshi Arimoto |
Session 5 - Imprint Lithography |
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| Introduction | Fabian Pease |
| Imprint Lithography: Getting to the Next Level | Jim Ellenson |
| Imprint Lithography for Dual Damascene Processing | Grant Willson |
| Imprint Lithography Enabling 32nm in Manufacturing | John Doering |
| 1X Template Fabrication | John Maltabes |
| 45nm Design Rule Templates Using VSB Technology | Mathias Irmscher |
| Template Fabrication with Gaussian Beam Tools | Osamu Nagarekawa |
| Materials for Nano Imprint Lithography | Ratnam Sooriyakumaran |
Session 6 - Maskless Lithography |
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| ML2 CoO Drivers and Issues | Lloyd Litt |
| High Throughput ML Lithography | Bert Jan Kampherbeek |
| Applications for Maskless E-Beam Lithography between R&D and Manufacturing | Johannes Kretz |
| Zone-Plate-Array Lithography with Comparison to E-Beam | Henry Smith |
| Optical ML Lithography | Kars Troost |
Litho Forum Participant Survey |
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| Survey Results | Bernie Roman |
Posters |
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EUV |
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| Current Status of SFET Development | Nobuaki Ogushi1, Shigeyuki Uzawa1, Hideo Yokota1, Norihisa Saito1, Koji Uda1, Yasuaki Fukuda2, Tamotsu Abe2, Akira Sumitani2, Naomichi Abe2; 1Canon Inc., 2EUVA |
| Development of DPP & LPP Light Source for EUV Lithography at EUVA | Naomichi Abe, Hakaru Mizoguchi, Hiroto Sato, Akira Endo and Koichi Toyoda; EUVA |
| Thermal and Optical Characterisation of Collectors for Extreme Ultra-Violet Lithography | Enrico Benedetti, Pietro Binda, Fabio Marioni, and Fabio E. Zocchi *; Media Lario |
| Current status of advanced EUV resists: resolution, line-edge roughness and speed | Patrick P. Naulleau1,2, Clemens Rammeloo2, Kim Dean3, Bruno La Fontaine4, Tom Wallow4, Carl Larson5 and Greg Wallraff5; 1Lawrence Berkeley Labs, 2University of Albany, 3SEMATECH, 4AMD, 5IBM |
Maskless |
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| Constant Data Rate Compression for Maskless Lithography Data Path | Thomas Karnowski; Oak Ridge National Lab |
| Fabrication and characterization of spatial light modulator for Optical Maskless Lithography | G.P. Watson, V. Aksyuk, D. O. Lopez, M. E. Simon, D. M. Tennant, R. A. Cirelli, W. M. Mansfield, F. Pardo, C. A. Bolle, A. R. Papazian, N. Basavanhally, and J. Lee, R. Fullowan, F. Klemens, J. Miner, A. Kornblit, T. Sorsch, L. Fetter, M. Peabody, and J. E. Bower; Lucent |
Imprint |
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| Dry Development Processes for SFIL/R Imprint Lithography (not available) | Tsuyoshi Yamashita, Ken Kramer, Ron Enck and Laura King; Hewlett Packard |
| Nanoimprint Lithography as Next Generation Lithography | William M. Tong, Wei Wu, Gun-Young Jung, James E. Ellenson, Timothy S. Hostetler, Kenneth M. Kramer, R. Stanley Williams, Laura H. King; Hewlett Packard |
| Defect inspection for imprint lithography using a die to database electron beam verification system (not available) | T. Hasebe1, T. Tokumoto1, C.Yan1, M. Yamamoto1, D. J. Resnick2, E. Thompson2, I. McMackin2 (Jim Alexander presenting); 1Nanogometry Research, 2Molecular Imprints |
Immersion |
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| Extending 193nm Optical Lithography to the 22-nm HP Node and Beyond | A.K. Raub, S. Smolev, A. Biswas, S.R.J. Brueck; Center for High Technology Materials, University of New Mexico |
| High-Index fluoride materials for 193 nm Immersion Lithography | Yoji Inui*1, Isao Masada1, Teruhiko Nawata1, Eiichi Nishijima1, Hiroki Sato2, Tsuguo Fukuda2; 1Tokuyama Corporation, 2IMRAM, Tohoku Univ. |
| Optical Properties of LuAg the High Index Lens Material for ArF Hyper NA Immersion Systems @193nm | Joachim Hengst, Lutz Parthier, Gunther Wehrhan; Schott Lithotec |
| Doubling Optical Lithography for the Home Stretch | Wolf Staud1, J. Fung Chen2; 1Cadence, 2ASML Masktools |
| Contemporary Design Paradigms Applied to Novel Lithography | F.M. Schellenberg, J.A.R. Torres; Mentor Graphics |
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