View Proceedings
by Topic

SEMATECH Litho Forum

23-24 May 2006
Vancouver, BC

(All presentations are in .PDF format)

Keynote: Industry Consensus and SEMATECH Technology Direction Giang Dao
2005 Updates to the Lithography Chapter of the ITRS Scott Hector

Session 1 - EUVL

  
Introduction Janice Golda
SEMATECH and Other Consortia EUV Programs Stefan Wurm
ASML EUV Alpha Demo Tool Development and Status John Zimmerman
Nikon EUVL Tool Development Progress Summary Takaharu Miura
EUV Source Development Progress Joseph Pankert
EUV Optics Contamination Iwao Nishiyama
Resist Development Status for EUVL Hiroto Yukawa
EUV Reticle Handling Kevin Orvek
EUV Mask Blank Development Dave Krick
EUV Mask Patterning Jan Hendrik Peters
EUV Extensibility Russell Hudyma

Session 2 - 193i Lithography

  
Introduction David Medeiros
Extensions of Wafer-Based ArF Immersion Lithography: High(er) NA & Multiple Exposure Processes Matt Colburn
ASML ArF Immersion Tool Development and Status Bill Arnold
ArF Immersion and Extension Masaomi Kameyama
193nm Immersion Lithography for 45nm and Beyond Akiyoshi Suzuki
Managing RET Complexity Under Immersion Frank Schellenberg
Mask Fabrication Challenges Christophe Pierrat

Session 3 - 193i+

  
Life Beyond Water Will Conley
Beyond Water Process Capability Shane Palmer
Resolution Limitations in Chemically Amplified Resists Grant Willson
Second Generation Fluids for 193nm Immersion Lithography Roger French
Outlook for Potential Third Generation Immersion Fluids Juan López Gejo
High Index Optical Materials John Burnett
Schott Lithotec Update on High Index Lens Materials Lutz Parthier
High Index Fluoride Single Crystal Yoji Inui
High Index Resists Andrew Whittaker

Session 4 - Electron Projection Lithography

  
Status of EPL Technology Hiroshi Arimoto

Session 5 - Imprint Lithography

  
Introduction Fabian Pease
Imprint Lithography: Getting to the Next Level Jim Ellenson
Imprint Lithography for Dual Damascene Processing Grant Willson
Imprint Lithography Enabling 32nm in Manufacturing John Doering
1X Template Fabrication    John Maltabes
45nm Design Rule Templates Using VSB Technology Mathias Irmscher
Template Fabrication with Gaussian Beam Tools Osamu Nagarekawa
Materials for Nano Imprint Lithography Ratnam Sooriyakumaran

Session 6 - Maskless Lithography

  
ML2 CoO Drivers and Issues Lloyd Litt
High Throughput ML Lithography Bert Jan Kampherbeek
Applications for Maskless E-Beam Lithography between R&D and Manufacturing   Johannes Kretz
Zone-Plate-Array Lithography with Comparison to E-Beam Henry Smith
Optical ML Lithography Kars Troost

Litho Forum Participant Survey

  
Survey Results Bernie Roman
   
   

Posters

  

EUV

  
Current Status of SFET Development Nobuaki Ogushi1, Shigeyuki Uzawa1, Hideo Yokota1, Norihisa Saito1, Koji Uda1, Yasuaki Fukuda2, Tamotsu Abe2, Akira Sumitani2, Naomichi Abe2; 1Canon Inc., 2EUVA
Development of DPP & LPP Light Source for EUV Lithography at EUVA Naomichi Abe, Hakaru Mizoguchi, Hiroto Sato, Akira Endo and Koichi Toyoda; EUVA
Thermal and Optical Characterisation of Collectors for Extreme Ultra-Violet Lithography Enrico Benedetti, Pietro Binda, Fabio Marioni, and Fabio E. Zocchi *; Media Lario
Current status of advanced EUV resists: resolution, line-edge roughness and speed Patrick P. Naulleau1,2, Clemens Rammeloo2, Kim Dean3, Bruno La Fontaine4, Tom Wallow4, Carl Larson5 and Greg Wallraff5; 1Lawrence Berkeley Labs, 2University of Albany, 3SEMATECH, 4AMD, 5IBM

Maskless

  
Constant Data Rate Compression for Maskless Lithography Data Path Thomas Karnowski; Oak Ridge National Lab
Fabrication and characterization of spatial light modulator for Optical Maskless Lithography G.P. Watson, V. Aksyuk, D. O. Lopez, M. E. Simon, D. M. Tennant, R. A. Cirelli, W. M. Mansfield, F. Pardo, C. A. Bolle, A. R. Papazian, N. Basavanhally, and J. Lee, R. Fullowan, F. Klemens, J. Miner, A. Kornblit, T. Sorsch, L. Fetter, M. Peabody, and J. E. Bower; Lucent

Imprint

  
Dry Development Processes for SFIL/R Imprint Lithography (not available) Tsuyoshi Yamashita, Ken Kramer, Ron Enck and Laura King; Hewlett Packard
Nanoimprint Lithography as Next Generation Lithography William M. Tong, Wei Wu, Gun-Young Jung, James E. Ellenson, Timothy S. Hostetler, Kenneth M. Kramer, R. Stanley Williams, Laura H. King; Hewlett Packard
Defect inspection for imprint lithography using a die to database electron beam verification system (not available) T. Hasebe1, T. Tokumoto1, C.Yan1, M. Yamamoto1, D. J. Resnick2, E. Thompson2, I. McMackin2 (Jim Alexander presenting); 1Nanogometry Research, 2Molecular Imprints

Immersion

  
Extending 193nm Optical Lithography to the 22-nm HP Node and Beyond A.K. Raub, S. Smolev, A. Biswas, S.R.J. Brueck; Center for High Technology Materials, University of New Mexico
High-Index fluoride materials for 193 nm Immersion Lithography Yoji Inui*1, Isao Masada1, Teruhiko Nawata1, Eiichi Nishijima1, Hiroki Sato2, Tsuguo Fukuda2; 1Tokuyama Corporation, 2IMRAM, Tohoku Univ.
Optical Properties of LuAg the High Index Lens Material for ArF  Hyper NA Immersion Systems @193nm Joachim Hengst, Lutz Parthier, Gunther Wehrhan; Schott Lithotec
Doubling Optical Lithography for the Home Stretch Wolf Staud1, J. Fung Chen2; 1Cadence, 2ASML Masktools
Contemporary Design Paradigms Applied to Novel Lithography F.M. Schellenberg, J.A.R. Torres; Mentor Graphics