EUV Mask & Chuck AND EUV Mask Handling Standards Working Groups Meetings

23 February 2003
Santa Clara, California

(All presentations are in .PDF format)

EUV Mask & Chuck Session

• Thermomechanical Modeling of the Pin-Chucked EUV Reticle During Exposure – Alex Wei, University of Wisconsin
• Electrostatic Chucking: EUV Issues & Related Experiences at IOF – Gerhard Kalkowski, Fraunhofer-IOF
• SEMI Draft Standard 3419 – From A Manufacturer’s Point Of View – Winfried Arens, Berliner Glas
• EUV Reticle Clamping – Mike Sogard, Nikon
• Image Placement Error Due to Pattern Transfer for EUV Masks – Pawitter Mangat, Motorola
• Comments to SEMI Draft 3419 and Revised Layout – Brian Blum, ASML
• EUV Mask & Chucking 3419 and P38 – Pawitter Mangat, Motorola
• Discussion of SEMI P38-1102 and Blue Ballot 3688 – Scott Hector, Motorola
• SEMI P37 Update – Thomas White, ISMT

EUV Mask Handling Session

• Reticle Handling Introduction – Thomas White, ISMT
• Reticle Handling Concept – Brian Blum, ASML
• Reticle Handling Survey – Thomas White, ISMT