EUV Mask Handling, Chucking, and Standards Workshop
03 October 2003
(All presentations are in .PDF format)
| Workshop Introduction |
Thomas White, AMD/ISMT |
| SEMI Standards
Status |
Scott Hector, Motorola/ISMT |
| North America
Update |
Thomas White, AMD/ISMT |
| Europe Update |
Christian Holfeld, AMTC |
| Japan
Update |
Iwao Nishiyama, ASET |
| Lawrence Livermore
National Laboratory Flatness Work |
Chris Walton, LLNL, and Eric Gullikson, LBNL |
| Schott Lithotec
Activities |
Lutz Aschke, Schott Lithotec |
| Zygo
Flatness Metrology and Handling |
Richard Eandi, Zygo |
| Reticle
Protection by Thermophoresis |
Mike Sogard, Nikon |
| ASML
Approach to EUV Reticle Handling |
Henk Meijer, ASML |
| International SEMATECH
North |
Kevin Kemp, Motorola/ISMT |
| Effect of Humidity on Electrostatic
Chucking |
Gerhard Kalkowski, Fraunhofer-IOF |
| Etec
Chuck and Handling Vision |
Tom Coleman, Etec |
| IBM
Carrier Cleanliness Preliminary Results |
Ken Racette, IBM |
| Proposed
Modifications to SEMI P10 |
Scott Hector, Motorola/ISMT |
| EUV Mask
Fiducial Marks |
Thomas White, AMD/ISMT et. al. |
| Update on
Next-Generation Pod Development |
Bernard Fay, representing Incam Solutions and Alcatel Vacuum |
| Influence
of Reticle Thickness on Image Placement Accuracy |
Liang Zheng and Roxann Englestad, University of Wisconsin |
Discussion
Session Notes
(includes proposed EUV mask layout) |
Thomas White, AMD/ISMT |
| Workshop Wrap-up |
Thomas White, AMD/ISMT |
| Discussion Session Comments |
|
| Workshop Minutes |
Thomas White, Scott Hector |