Plenary Session |
| Technology and Manufacturing Innovations: New SEMATECH Initiatives |
Daniel Armbrust, SEMATECH |
| Si-Based Integrated Technology Innovation |
Dr. Jack Sun, TSMC |
| 3D IC Standardization: OSATS Perspective |
Dr. Yi-Shao Lai, ASE Group |
| Resistive Random Access Memory Based on ALD HfO2 |
Dr. Ming-Jer Kao, ITRI |
Pushing the Patterning Limits: Advances in EUV Lithography |
| FEI Tool Applications – EUV Mask Blank Defect Reduction Program |
Eric Van Cappellan, FEI |
| EUVL Development at SEMATECH |
Bryan Rice, SEMATECH |
| Protection of EUV Reticle Handling |
Bill Chiu, Gudeng |
Realizing the Potential: Driving 3D Into Mainstream Manufacturing |
| 3D TSV Interconnects / 3D Enablement Center – SEMATECH |
Sitaram Arkalgud, SEMATECH |
| TSV Interposers: The Most Cost-Effective Integrator for 3D IC Integration |
John Lau, ITRI |
Advanced CMOS Devices and Beyond: Innovations in Materials and Nanostructures |
| Materials and Structural Transitions |
Paul Kirsch, SEMATECH |
| Non-planar Outlook and Module Development for High Mobility Ge/III-V Channels |
Chris Hobbs, SEMATECH |
| 3D Charge Trapping NAND Flash Memory |
Yen-Hao Shih, Macronix |
The Industry’s Enabler: Perspectives on Metrology Challenges |
| Metrology Program Overview |
John Warlaumont, SEMATECH |
| Low K1 Lithography Manufacturing and Metrology Requirements |
Chih-Ming Ke, TSMC |
| Multiwavelength Raman and PL Spectroscopy: Promising In-Line Diagnostic Metrology for 20nm Technology Node and Beyond |
Woo Sik Yoo, Wafermasters |
| High Volume, Automated TEM-based Metrology |
Larry Dworkin, FEI |
| Top 5 Lithography Metrology Challenges |
Bryan Rice, SEMATECH |
Accelerating Momentum: Innovation and Collaboration in the 450 mm Transition |
| Effective Collaboration for 450mm |
Jonathan Chang, TSMC |
| The 450 mm Transition: Consortium Status, Plans, and Strategy |
Richard Young, SEMATECH |
| The 450 mm Transition: An Equipment Supplier’s Perspective |
Neil Hanson, LAM |
| 450-mm Wafer Carrier Development in Taiwan |
Bill Chiu, Gudeng |
| Q/A, Closing Remarks |
Richard Young, SEMATECH |
Semiconductor Factory Evolution: Opportunities for Increased Productivity |
| Opening Remarks |
Sanjay Rajguru, ISMI |
| SEMATECH Industry Economic Model |
Marcus Lentz, ISMI |
| New Fab Design Concepts – Facilities Council Presentation |
Terry Behrens, CH2M Hill |
| Energy Reduction Concepts for New and Existing Fab |
Steve Trammell, ISMI |
| Collaboration for Equipment Productivity Gains |
Julian Richards, ISMI |
Statistics for the Semiconductor Industry |
| Intelligent Statistical Methods for Safer and More Robust Qualifications |
Michael Haslam, Predictum |