Plenary Session |
| Technology & Manufacturing
Innovations: New SEMATECH Inititiatives |
Dan Armbrust, SEMATECH |
| The Future Memory Technologies |
Sung-Ki Park, Hynix Semiconductor |
| The Trend of TSV Packaging |
Choon-Heung Lee, Amkor Technology
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Pushing the Patterning Limits: Advances in EUV Lithography |
| SEMATECH’s Lithography Program: Enabling the EUVL Infrastructure |
Stefan Wurm, SEMATECH |
| Mask and Its Inspection Technology for Advanced EUV Lithography |
JinHo Ahn, HanYang University |
| EUVL Defect Printability: An Industry Challenge |
Harry Kwon, SEMATECH |
Realizing the Potential: Driving 3D Into Mainstream Manufacturing |
| 3D TSV Interconnects; SEMATECH’s 3D Enablement Center Program |
Sitaram Arkalgud, SEMATECH |
| Technical Challenges in 3D-TSV Integration |
Sung-Dong Cho, Samsung |
Advanced CMOS Devices and Beyond: Innovations in Materials and Nanostructures |
| Progress on RRAM as a Future
Non-Volatile Memory |
Paul Kirsch, SEMATECH |
| Advanced CMOS Scaling, Predictive Modeling |
Chang Yong Kang, SEMATECH |
| Bulk FinFETs: Fundamentals, Models, and Applications |
JongHo Lee, Seoul National University |
| III-V CMOS Devices, Non-planar Devices |
Jungwoo Oh, SEMATECH |
Semiconductor Factory Evolution: Opportunities for Increased Productivity |
| Manufacturing Technology Projects – Wait Time Waste, Equipment Obsolescence, Finger Printing, Predictive Health Maintenance (PHM) |
Sanjay Rajguru, ISMI |
| ESH Technology – Regulatory Update |
Steve Trammell, ISMI |
Accelerating Momentum: Innovation and Collaboration in the 450 mm Transition |
| The 450 mm Transition: Consortium Status, Plans, and Strategy |
Richard Young, SEMATECH |
| Advanced Plasma Sources for 450mm Process |
HongYoung Chang, KAIST |
| 450mm LPCVD Equipment Preparedness and Process Readiness of Eugene Technology |
Scott Youn, Eugenetech |
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