Keynotes |
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| SEMATECH: Creative Collaboration in Advanced Technology R&D |
Dan Armbrust, President & CEO, SEMATECH |
| ISMI: Industry Productivity Driver |
Scott Kramer, Vice President, Manufacturing, SEMATECH |
| Pursuing Further Growth of Semiconductor Industry |
Terry Higashi, Chairman,Tokyo Electron |
EUV Lithography |
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| EUVL Development at SEMATECH |
Bryan Rice, SEMATECH |
| Challenges and Solutions
for EUV Lithography |
Suigen Kyoh, Toshiba |
| EUV Resist Development Toward 22nm hp Design and Beyond |
Tsutomu Shimokawa, JSR |
| Development Status of EUVL Blank and Substrate |
Mitsuhiko Komakine, Asahi Glass |
| Major Technical and Engineering Challenges
of LPP-EUV Light Source for HVM-EUVL |
Junichi Fujimoto, Gigaphoton |
3D-TSV Interconnects |
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| 3D TSV Interconnects at SEMATECH |
Sitaram Arkalgud, SEMATECH |
| Updated Results of R&D on Functionally Innovative
3D-Integrated Circuit (Dream Chip) Technology |
Morihiro Kada, ASET |
| Concerns of 3D Integration Technology Using TSV |
Kangwook Lee, Tohoku University |
| A Study of Resist Patterning for TSV Process |
Ken I. Mori, Canon |
| Development of TSV Etching Depth Measurement System |
Hideo Takizawa, Lasertec |
Advanced CMOS Technologies |
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| Advanced CMOS Scaling |
Prashant Majhi, Intel |
| CMOS Scaling Toward
14 nm Generation |
Mariko Takayanagi, Toshiba |
| Overview of SEMATECH High-k/Metal Gate Development |
Paul Kirsch, SEMATECH |
Advanced Memory & Emerging Technologies |
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| RRAM Materials Development at SEMATECH |
Paul Kirsch, SEMATECH |
| Phase-Change Meta-materials for Future PCRAM |
Junji Tominaga, AIST |
| III-V Channel Materials for Future CMOS |
Prashant Majhi, Intel |
| Performance Booster Technologies:
Stress Engineering, (110) FETs,
Ultrathin-body FETs, and CNT FETs |
Ken Uchida, Tokyo Institute of Technology |
| More Moore or More than Moore? |
Raj Jammy, SEMATECH |
Environment, Safety, and Health (ESH) |
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| Semiconductor Manufacturing ESH – A Consortium Approach |
James Beasley, ISMI |
| Intel Green Manufacturing Facility Activity
LEED certification at KM1/Malaysia |
Shigeru Urashima, Intel |
| Edwards' Energy Reduction Focus |
Katsunori Takahashi, Edwards Vacuum |
Mature Fabs |
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| ISMI's Mature Fab Program |
Scott Kramer, ISMI |
450 mm |
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| ISMI's 450 mm Transition Program |
Scott Kramer, ISMI |
| Interoperability Test Group for 450 mm Industry Standard Development Japan |
Makoto Yamamoto, Muratec |
| ISMI Factory Interoperability Test Bed |
Eddy Bass, Intel |
| Vacuum Platform Technology
For 450 mm |
Munekazu Komiya, RORZE/ Yu-Chi Chen, TSMC |
| 450mm Starting Materials Working Group Activities |
Mike Goldstein, Intel |
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