Through a series of lectures and workshop sessions, SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) presented a variety of technology solutions and manufacturing methods at SEMICON West in San Francisco, CA. SEMATECH and ISMI experts showcased their latest advances in new materials and device structures and lithography with a special focus on addressing key opportunities and challenges in 3D interconnect technology.
ISMI Energy Study Reveals Opportunities to Reduce Consumption, Emissions and Costs in Semiconductor Manufacturing
ISMI’s recently released Worldwide Fab Energy Study, conducted at 300 mm and 200 mm semiconductor manufacturing facilities in Asia, North America, and Europe, shows a dramatic decline in normalized fab energy consumption from 1997 to 2011. The study determined that energy consumed by process equipment—which according to the latest survey accounts for more than 50 percent of a facility’s energy usage—has improved its efficiencies by half in 2011, and non-process equipment energy consumption has been reduced to one quarter of the 1997 levels. In addition, the study also provides benchmark data to help members identify other areas to reduce energy use and improve efficiency in semiconductor manufacturing operations.
Industry veteran Michael Lercel has joined SEMATECH as senior director for nanodefectivity and metrology, leading SEMATECH’s ongoing metrology program as well as a new Nanodefect Center based at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex. As director of these two initiatives, Lercel will be responsible for developing and executing strategies to overcome the industry’s most pressing defectivity and metrology challenges.
SEMATECH announced that Inpria, a developer of chemical materials for the deposition of high-performance oxide thin films, has recently joined SEMATECH’s Resist and Materials Development Center (RMDC).
Inpria’s inorganic resists have resolved 11 nm line/space features and exhibit extremely high etch resistance. In this collaboration, Inpria and SEMATECH will extend such high-resolution resists to qualify the 0.5 NA EUV imaging optics at the heart of the major upgrades underway to support resist research for 11 nm half-pitch and below in the RMDC facilities.
Solid State Equipment LLC (SSEC), a manufacturer of single wafer wet processing equipment for the semiconductor industry, has joined SEMATECH’s 3D Interconnect program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. The collaboration between SSEC and SEMATECH will include evaluation and development of leading-edge wafer thinning and through-silicon via (TSV) wafer cleaning processes.
Winbond Electronics Joins ISMI to Develop Productivity Solutions for Semiconductor Factories and Equipment
SEMATECH announced recently that Winbond Electronics Corporation has joined the International SEMATECH Manufacturing Initiative (ISMI) program based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. Winbond will join ISMI and its members to develop innovative manufacturing capabilities to solve common productivity, cost and cycle time challenges in semiconductor factories and equipment.
Semiconductor Experts Demonstrate Solutions to Improve Equipment Processes, Throughput and Costs at ISMI Manufacturing Week
Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.
SEMATECH announced recently that Kumho Petrochemical, a Korea-based company that produces photoresist materials for semiconductor production, has joined SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. As a resist member of SEMATECH’s lithography program, Kumho will team with SEMATECH engineers to accelerate the development of EUV materials and resists for use at the 22 nm node and beyond.
In This Issue
This is a remarkable time for our industry. In addition to preparing for the game-changing transitions on the horizon—in areas such as 3D interconnects, EUV lithography, and the 450 mm wafer transition— we are also exploring a host of novel options in materials and device structures. These advances, taken together, will drive and sustain our technology roadmap and keep the industry on its historic productivity curve over the next decade.
As we explore multiple technology options and contend with rising R&D and manufacturing costs, it is more important than ever that we share resources, cost, and risk to enable wise technology and investment decisions.
In this issue we focus on how SEMATECH continues to broaden and expand our membership to collectively tackle some of the industry's greatest technology and manufacturing challenges.
SEMATECH's 9th Annual Mask Cleaning Workshop
2012 International Symposium on Extreme Ultraviolet Lithography
9th International Symposium on Advanced Gate Stack Technology
Advanced Metallization Conference
As manager of ISMI’s ESH program, Hsi-An is leveraging SEMATECH’s long history in tackling challenges such as compliance with existing regulations; reduction of harmful fab emissions; and conservation of energy, water, and chemical resources.
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