Tech Report Newsletter



THIRD QUARTER 2008	In this Issue
UMC joins SEMATECH SEMATECH and United Microelectronics Corporation (UMC), a leading global semiconductor foundry, have announced UMC’s decision to join SEMATECH. The relationship will focus on research and development for exploratory technologies on 300 mm wafers, including 22 nm and beyond process generations. Read more SEMATECH demonstrates critical advancements in EUV resist development SEMATECH engineers have demonstrated chemically amplified resist platforms that support 22 nm half-pitch resolution and are close to resolving sub-20 nm half-pitch features. These significant advances are critical in advancing the infrastructure that will prepare extreme ultraviolet lithography (EUVL) for high volume manufacturing at the 22 nm half-pitch. Read more ISMI's 450 mm Program tackles early infrastructure challenges ISMI’s 450 mm Program is dedicated to moving ahead with 450 mm industry capability to increase productivity and decrease costs. The goal is to establish a 450 mm tool demonstration line to support member stakeholder plans for pilot lines by 2012. The effort is now well underway with the Interoperability Test Bed for testing of prototype automation and equipment interfaces. Read more SEMATECH engineers earn best paper award SEMATECH has received the Solid State Devices and Materials (SSDM) Best Paper Award for its work on reliability of high-k metal gates. The paper, entitled “nMOSFET Reliability Improvement attributed to the Interfacial Dipole formed by La Incorporation in HfO2,” investigates the reliability of nMOSFETs with lanthanum-doped HfO2 dielectrics, whose device performance and voltage threshold are suitable for future technology nodes applications. Read more Resist and mask progress reported at EUVL Symposium Significant advances in moving forward the infrastructure that will prepare extreme ultraviolet lithography (EUVL) for cost-effective manufacturing were presented recently at the EUVL Symposium. At the same time, other speakers at the event also highlighted various technology, infrastructure, and business challenges that the industry needs to address to successfully insert EUVL into manufacturing at the 22 nm half-pitch node. Read more Technologists discuss the future of 193 nm high-index immersion and other extensions to optical lithography Results from immersion lithography in every field from high-index immersion and double patterning to fundamental resist enhancements and manufacturing readiness were demonstrated at the 5th International Symposium on Immersion Lithography Extensions held recently in The Hague. Read more Sustaining business with smart partnering With R&D costs escalating out of control (semiconductor R&D costs are expected to reach $49.2 billion (USD) in 2008 and double by 2012), chip makers are forming technology alliances to offset R&D costs and meet the need for complementary specialized skills to generate new technologies. As a result, some IC makers are abandoning the in-house R&D model and relying on strategic partnerships for the migration of technology. Read more Who's talking SEMATECH and ISMI executives and technical experts will present technology development highlights, program updates, and strategic direction for the accelleration of technology innovation at upcoming conferences and symposia worldwide. See who's talking Subscribe now! Don't miss the next issue of the TECHreport. SUBSCRIBE HERE to receive this newsletter via e-mail each quarter.	INNOVATION and CONNECTIONS: These are the keys to staying productive and profitable in a challenging economy and a changing industry. In this issue, we recognize our scientists and engineers who explore new technologies and make critical breakthroughs; our manufacturing experts who solve productivity and yield challenges; and the innovation and entrepreneurial spirit of our business leaders who bring our products and services to market. We also highlight the smart partnerships that help reduce cost and risk, foster innovation, and increase productivity. Upcoming Meetings ISMI/SEMATECH Symposium Japan October 30‑31, 2008 Tokyo, Japan 3D Design and Test Workshop November 13, 2008 San Jose, California Workshop on Maskless Lithography December 14, 2008 San Francisco, CA SEMATECH Surface Preparation and Cleaning Conference * * * Call for Papers * * * March 23-25, 2009 Austin, Texas Professional Profile As SEMATECH’s Business Development Director, Mark Sheedy plays an integral role in developing and implementing business development strategies, building broad-base awareness of SEMATECH’s collaborative program and membership opportunities, and closing on new “smart partnerships.” In this professional profile, Sheedy discusses the key components of successful collaboration through cooperative R&D. Read more
Copyright 2008