SEMATECH Dictionary of Semiconductor Terms

A-Am | An-Az | B | C-Ch | Ci-Com | Con-Cz | D-De | Df-Dz | E-En | Eo-Ez | F-Fl
Fm-Fz | G | H | I | J-K | L | M-Mes | Met-Mz | N | O | P-Ph | Pi-Pq | Pr-Pz | Q | R
S-Se | Sh-So | Sp-Sta | Ste-Sz | T-Th | Ti-Tz | U-V | W-Z

"F - Fl "

fab n		the main manufacturing facility for processing semiconductor wafers. [SEMATECH]
facilities cost model (FCM) n		a construction cost estimator developed by SEMATECH for evaluating the costs of various facility options, particularly for 0.25 mm wafer fabrication facilities. FCM includes regional cost factors data, a tool list database, and a unit costs database. It calculates total project area including cleanroom, fab support area, office space, and central utilities building area, and it provides a detailed cost estimate by subsystem. [SEMATECH]
facilities-related downtime n		a period when the equipment cannot perform its intended function solely as a result of out-of-specification facilities. These facilities include environmental conditions (such as temperature, humidity, vibration, and particle count); house hookups (such as power, cooling water, house gases, exhaust, and LN2); and communications links with other equipment or host computers. [SEMI E10-92]
factory control system n		a computer system that receives data and coordinates production equipment, materials handling systems, and factory personnel. [SEMATECH]
factory host n		computers that reside above a cluster controller in the logical factory control hierarchy. Responsibilities include higher level planning, scheduling, optimization, and computer data analysis; typically the location of the factory computer-aided manufacturing system. [SEMATECH]
factory integration n		the coordination of all of the elements required to successfully operate a factory; that is, product definition, human factors, material flow, equipment scheduling/control, environmental controls, and facilities. [1994 National Technology Roadmap for Semiconductors]
factory layout/relayout tool		see FLRT.
fail safe n		a system so designed that a failure of any component in the system will stop the equipment and prevent unsafe operation of the equipment. [SEMI S2-93]
failure n		1 : in the pressure testing of fluorocarbon tube fittings, any external leakage of fluid through the tube wall or the tube fitting connection, whether it be catastrophic or a slow leak. [SEMI F10-93] 2 : in the seal testing of fluorocarbon tube fittings, the separation of a tube from a tube fitting connection, or the tearing of the tube. [SEMI F7-92]. Also see equipment failure.
failure mechanism n		in failure analysis, a fundamental process or defect responsible for a failure. [SEMATECH]
failure mode n		in determining life cycle of valves, the mode by which a failure is observed to occur. Failure mode types include a catastrophic failure that is both sudden and complete and degraded failure that is gradual, partial, or both. [SEMATECH]
failure mode and effects analysis (FMEA) n		an analytically derived identification of the conceivable equipment failure modes and the potential adverse effects of those modes on the system and mission. [SEMATECH]
failure unit (FIT) n		in reliability engineering, one failure per billion (109) device hours. [SEMATECH]
false negative n		a measurement that indicates the failure to count a particle that is present. [SEMATECH]
false positive n		a measurement that indicates the presence of particles when no particles are present. [SEMATECH]
fast axis n		in optics, of a doubly refracting crystal, the direction in which the velocity of light is a maximum. [ASTM F1241]
fasciculation n		a localized, uncoordinated, and uncontrolled twitching of a single muscle group. [SEMATECH]
fast track n		a building method in which construction begins before plans and designs are fully completed. [SEMATECH]
fault n		1 : an accidental condition that causes a functional unit to fail to perform its required function. [SEMATECH] 2 : a defect-causing out-of-spec operation of an integrated circuit. [SEMATECH] Also see exception condition.
fault coverage n		the percentage of a particular fault type that a test vector set will detect when applied to a chip. [1994 National Technology Roadmap for Semiconductors]
fault dictionary n		a list of faults that a test vector will detect in a failing circuit, or a list of all such faults for each vector in a vector set. [1994 National Technology Roadmap for Semiconductors]
fault model n		a model of the behavior of defective circuitry in an integrated circuit. Physical defects result in improper behavior in a circuit which must be modeled in order for test patterns to be designed to properly detect them. Examples include stuck-at model, timing model, and bridging model. [1994 National Technology Roadmap for Semiconductors]
fault probability n		the ratio of critical area to die area for an integrated circuit. [SEMATECH] Also called probability of failure.
fault simulation n		a simulation of a chip with a given set of test vectors with the expresses purpose of determining the extent to which the given test vectors detect a specific type of fault. [1994 National Technology Roadmap for Semiconductors]
FCM		see facilities cost model.
feature n		an area within a single continuous boundary (for example, an aggregate image) that has an optical-density value (gray-level range) that is distinct from the background area outside the feature; for example, the simplest element of a pattern such as a single line, space, or L-bar. [SEMI P19-92]
feature group n		a small assembly of one or more similar features arranged together, such as three nested L-bars. [SEMI P19-92]
feature height n		in scanning tunneling microscopy and atomic force microscopy, the height of features on a surface profile; the distance in the Z-direction of any point in a microscope's scan area, relative to the lowest point in the scan area, as derived from measurement fluctuations during raster. [SEMATECH]
feature size n		1 : the physical dimensions of an individual pattern element, usually expressed as minimum feature size. For example, a 0.8 micrometer process has a minimum gate dimension of 0.8 micrometer. 2 : in surface characterization, any measurable three-dimensional surface irregularity, not necessarily oriented to any particular reference plane. [SEMATECH]
federal laboratories n		a nationwide network of specialized laboratories, such as the National Institute for Standards and Technology (NIST), funded and administered by the U.S. federal government. [SEMATECH] Contrast with national laboratories.
feedback n		1 : in atomic force microscopy, a process by which the cantilever is moved in the Z-direction relative to the sample to maintain a constant force during scanning. 2 : in scanning tunneling microscopy, a process by which the tip is moved in the Z-direction relative to the sample to maintain a constant current during scanning. [SEMATECH]
FEOL		see front end-of-line.
FET		see field-effect transistor.
F/I n		abbreviation for final inspect. See linewidth, etched.
fiber optics n		a technique for transmitting light through very fine, flexible glass rods by means of internal refraction. [SEMATECH]
fibrosis n		the formation of fibrous connective tissue, often in response to excessive inhalation of dust. [SEMATECH]
fidelity n		the degree of correspondence of an image in shape and orientation to an original image from which it was derived. [ASTM F127-84]
field n		the printed pattern from a reticle. [SEMATECH]
field-effect transistor (FET) n		a transistor consisting of a source, gate, and drain, the action of which depends on the flow of majority carriers past the gate from the source to the drain. The flow is controlled by the transverse electric field under the gate. [SEMATECH]
field flatness n		in the measurement of photolithographic instruments, the difference between the maximum and the minimum Z-axis positions over the focal surface. [SEMI P25-94]
field rotation n		the rotation of a printed reticle pattern with respect to previously exposed fields. [SEMATECH]
FIFO n		first-in, first-out dispatch policy. With this policy, the lot that has waited the longest in a queue will be the next lot selected for processing. [SEMATECH]
filler wafer		see wafer, dummy.
fillet n		the filling in at the intersection of two lines to produce a concave junction or the rounding of a corner. [ASTM F127-84]
film n		a layer of contaminant on part or all of a wafer. An example is wax that has migrated onto the wafer surface. [SEMI M10-89]
film adhesive n		in the manufacture of photolithographic pellicles, adhesive between frame and film. [SEMI P5-94]
film defects n		in the manufacture of photolithographic pellicles, inconsistencies in the integrity and planarity of the film, including particles, pinholes, scratches, dirt, and a minute quantity of solid. [SEMI P5-94]
film permeability n		the measure of the rate at which chemical reagents penetrate a film. [SEMATECH]
film stress n		compressive or tensile forces that affect the film on a wafer. [SEMATECH]
filter cartridge n		of a fluid distribution system filter, the filtration element. [SEMATECH]
filter housing n		of a fluid distribution system filter, the shell that contains the filter cartridge. [SEMATECH]
filtration efficiency n		the ability to effectively remove contaminants, such as the ability of a cleanroom face mask to effectively remove aerosols and hydrosols from human breath as it is exhaled. [SEMATECH]
filtration unit n		of a fluid distribution system filter, the assembly consisting of a filter cartridge and housing. Examples are an integral unit, in which the filter cartridge and element are not separable, and a separable unit, in which the filter cartridge and housing can be disassembled. [SEMATECH]
fin n		on a ceramic semiconductor package or cap, a fine, feathery-edged projection of parent material on a corner of the ceramic body. [SEMI G58-94] Contrast burr.
final inspect (F/I)		see linewidth, etched.
final steady state value n		in mass flow controller testing, the average value of the actual flow, after the effects of the input transient have expired to a value equal to or below the intrinsic drift and noise. [SEMI E17-91]
fingerprint n		residual surface contamination deposited on a photomask or photoplate during handling. [SEMI P2-86]
finish n		in the plating of integrated circuit leadframes, the final plating layer. [SEMI G21-94]
finite state machine model (FSM) n		a model of a hypothetical machine that can be in only one of a given number of states at any specific time. In response to an input, the machine generates an output and changes state. Both the output and the new state are functions of the current state and the input exclusively. [SEMI E30-94] Also called finite state machine.
fired		see cofired.
first-in, first-out		see FIFO.
fishtails n		structures, attributed to substrate defects, either above or below the surface plane after epitaxial deposition; the "tails" are aligned in a particular crystallographic direction. [ASTM F1241] Also see crescents.
fissure		see crack.
FIT		see failure unit.
fixative n		a material that prevents morphological changes to biological structures. [SEMATECH]
fixed quality area (FQA) n		the central area of a wafer surface, defined by a nominal edge exclusion, X, over which the specified values of a perimeter apply. [ASTM F1241]
flake n		material missing from one but not the other side of a semiconductor wafer. [SEMI M10-89]
flake chip		see chip and peripheral chip.
flaking		see peeling.
flammable aerosol n		a compressed liquid that yields a flame projection of 18 inches at the full valve opening or a flashback at any degree of valve opening when tested. [SEMATECH]
flammable liquid n		a liquid that has a flash point below 37.8 degrees C (100 degrees F) and a vapor pressure not exceeding 40 psi (absolute) at 37.8 degrees C. [ASTM E772-87]
flange n		in plastic and metal wafer carriers, the material on the exterior of a wafer carrier and perpendicular to the side walls. [SEMI E1-86] Also see wafer carrier.
flare n		in flat panel display substrates, a horn-shaped corner or projection on a score-cut edge. [SEMI D9-94]
flash n		the areas of molding compound between the edge of plastic molded packages and the dambars or leadframe rails. In worn molds, the flash may extend beyond the leadframe dambars due to imperfections in clamming the surfaces of the mold to leadframe surfaces. [SEMATECH] Contrast with resin bleed.
flash characteristics n		of thermosetting molding, factors (such as mold condition, viscosity of the molding compound, and curing characteristics) describing semiconductor-grade transfer molding compounds used to form semiconductor packages and chip carriers, especially that portion of the compound that overflows the mold. [SEMATECH]
flash memory n		a nonvolatile semiconductor memory consisting of 1-transistor cells wherein charge storage in the gate dielectric is the memory mechanism, and a second gate on the transistor enables serial insertion of data and simultaneous erasure of defined blocks of memory electronically. [1994 National Technology Roadmap for Semiconductors]
flat n		on a semiconductor wafer, a portion of the periphery of a circular wafer that has been removed to a chord. [SEMI M1-94 and ASTM F1241] Also see primary orientation flat and secondary flat.
flatband capacitance (Cfb) n		the capacitance of a metal oxide semiconductor structure at the flatband voltage. [ASTM F1241] Also see flatband condition.
flatband condition n		in metal oxide semiconductor microelectronics, the point at which an external applied voltage causes no internal potential difference across a metal oxide semiconductor structure. [ASTM F1241]
flatband voltage (Vfb) n		the applied voltage necessary to produce the flatband condition. [ASTM F1241] Also see flatband condition.
flat diameter n		in the manufacture of silicon wafers, the linear dimension across the surface of a semiconductor wafer from the center of the flat through the wafer center to the circumference of the wafer on the opposite edge along the diameter perpendicular to the flat. [SEMI M1-94]
flatness n		1 : for wafer surfaces, the deviation of the front surface, expressed in total indicator reading (TIR) or maximum focal plane deviation (FPD), relative to a specified reference plane when the back surface of the wafer is ideally flat, as when pulled down by a vacuum onto an ideally clean, flat chuck. [SEMI M1-94 and ASTM F1241] Contrast bow and warp. Also see global flatness and site flatness. 2 : in a ceramic package or leadframe, the allowable deviation of a surface from a defined reference plane. The tolerance zone is defined by two parallel planes within which the surface must lie. [SEMI G61-94] Also see camber.
flat zone n		in an epitaxial layer, the depth from the front surface to the point where the net carrier density is 20% greater than or less than the average net carrier density of the region between 0.25 and 0.75 of the layer thickness. [SEMI M2-94]
flip-chip n		a leadless, monolithic structure that contains an integrated circuit designed to electrically and mechanically interconnect to a hybrid circuit. Connection is made to bump contacts covered with a conductive bonding agent on the face of the hybrid. [SEMATECH]
floor planning n		the act of determining a physical layout of an integrated circuit from information contained in a netlist and a library of the physical characteristics of individual cells contained in the netlist. The purpose of floor planning is to obtain a physical layout that is acceptable in terms of system requirements, such as area, clock speed, power, and signal integrity. [1994 National Technology Roadmap for Semiconductors]
flow coefficient (Cv) n		the number of standard cubic meters of air per minute that can flow through a valve at a pressure drop of 1 psi. [SEMATECH]
flow curve n		for regulators, the difference between the set pressure at zero flow and the outlet pressure as the flow is increased, represented by a curve. [SEMATECH] Also called droop.
flow limiting device n		a device installed in a valve that is designed to reduce the maximum flow from the valve under full flow conditions. [SEMI S5-93]
flow rate n		measurement of the amount of fluid or gas that passes one point at a given time. [SEMATECH]
flow velocity (V) n		in equipment exhaust systems, the average speed at which the effluent stream travels through the exhaust duct. It is measured in meters per second (m/s) or feet per minute (fpm). [SEMI S6-93]
flow volume (Q) n		in equipment exhaust systems, the volumetric flow rate of the effluent stream passing a given location in the exhaust system per unit of time. It is measured in cubic meters per second (m3/s) or cubic feet per minute (cfm). [SEMI S6-93]
FLRT n		factory layout/relayout tool, which is a SEMATECH project to provide fab designers with tools for developing and assessing fab layouts. [SEMATECH]
fluorescence n		the emission of light as the result of, and only during, the absorption of radiation of shorter wavelengths. (Copyright 1993 IEEE. All rights reserved.)
flux n		the number of particles flowing through a given area per unit time. [ASTM 1296-92]

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