SEMATECH Dictionary of Semiconductor Terms

A-Am | An-Az | B | C-Ch | Ci-Com | Con-Cz | D-De | Df-Dz | E-En | Eo-Ez | F-Fl
Fm-Fz | G | H | I | J-K | L | M-Mes | Met-Mz | N | O | P-Ph | Pi-Pq | Pr-Pz | Q | R
S-Se | Sh-So | Sp-Sta | Ste-Sz | T-Th | Ti-Tz | U-V | W-Z

"Sp-Sta"

space n		the more reflective element of a bar code, usually formed by the background between the bars. [SEMI T1-93]
space-charge layer		see depletion layer.
spacing n		in cassettes or containers, the minimum spacing between cassette or container centroids. [SEMI E15-91]
span n		in the linearity of mass flow devices, the algebraic difference between the upper and lower range values. [SEMI E27-92]
span effect n		in the temperature specifications of mass flow controllers, the change in span due to a change in ambient temperature from one normal operating temperature to a second normal operating temperature. All other conditions must be held within the limits of reference operating conditions. [SEMI E18-91]
spatial wavelength n		in characterizing surface condition by noncontact optical profilometry, the corresponding lateral distance between two consecutive peaks for a surface that is a pure sinusoidal departure from the mean plane. [SEMATECH]
SPC		see statistical process control.
special cause n		a source of variation that is intermittent, unpredictable, or unstable and that affects only some of the individual values of the process output being studied. [EIA 557] Also called assignable cause. Contrast common cause.
specification n		1 : a detailed, precise description of a tool, material, process, method, or procedure. [SEMATECH] 2 : a detailed definition of the logic used by an application or a program. [SEMATECH]
specification limits (spec limits) n		the requirements for judging the acceptability of a particular characteristic. [EIA 557]
specific equipment model n		an equipment model for a particular type of equipment (for example, steppers, wire bonders, diffusion furnaces, etc.). [SEMI E30-94] Also see Generic Equipment Model.
specific gravity n		the ratio of the mass of a gas to the mass of an equal volume of air at a specified temperature. For liquids, it is the ratio of the mass of the liquid to the mass of an equal volume of water. [SEMI C3-94]
specified band n		in mass flow controller testing, the region between ±2% of the final steady state value or ±0.5% of full scale, whichever is greater. [SEMI E17-91]
spectral line n		an image of a slit formed in the focal plane of a spectrograph or spectrometer and having a width approximately equal to that formed by monochromatic radiation. [ASTM C859-92]
spectrometer n		an instrument with an entrance slit, a dispersing device, and one or more exit slits, with which measurements are made at selected wavelengths within the spectral range, or by scanning over the range. The quantity detected is a function of radiant power. [ASTM E135-94]
spectrometry n		a method based on designation of the wavelengths within a particular portion of a range of radiations or absorptions, for example, ultraviolet (UV), emission, or absorption spectrometry. [ASTM E375]
spectroradiometer n		an instrument for measuring the spectral concentration of radiant energy or radiant power. [ASTM E349-72]
spectroscopy n		an instrument for dispersing radiation into a spectrum for visual observation or emission or absorption. [ASTM E375]
speed binning n		the practice of sorting devices at final electrical test on the basis of performance in a switching speed test. The variations in performance result from process variances. The products are given product designations based on operating speed ranges. [1994 National Technology Roadmap for Semiconductors]
SPIDER n		a set of electrical test structures used during tool development to diagnose and measure the effects of damage on translator devices in a qualitative way. Abbreviation for SEMATECH process-induced damage effect revealer. [SEMATECH]
spike n		1 : in an epitaxial wafer surface, a tall, thin dendrite or crystalline filament that often occurs at the center or recess. [ASTM F1241] 2 : an extreme structure that has a large ratio of height-to-base width and no apparent relation to epitaxial film thickness. [SEMATECH] Also see pyramid and mound.
spin n		an operation in which a metered amount of resist is applied to a wafer while it is spinning; the operation in which a substrate is rotated about an axis perpendicular to its surface while, or immediately after, a coating material is applied in liquid form to the substrate surface. [SEMATECH]
spin coating		see spin.
spine-based AMHS layout n		positions work-in-progress stockers at the beginning of the processing bays and has the automated material handling system (AMHS) track circulating within the main corridor of the fabrication area. [SEMATECH]
spin-on glass n		a solvent-based liquid that is applied to substrates using a spin-coat process; subsequently forms a thin, solid film exhibiting the properties of silicon dioxide after curing. [SEMATECH]
spinner		see coater.
spin webbing n		the filamentary residue of excess resist spun from the substrate surface during spin coating that falls onto the substrate surface. [ASTM F127-84]
spiral n		1 : on a wafer, a texture that circles around a central point in a widening spiral pattern. [SEMATECH] 2 : on a semiconductor wafer, "orange peel" type surface texture with a spiral pattern. [ASTM F1241]
spiral flow n		a measure of the molding characteristics of a thermosetting plastic molding compound for semiconductor devices. The shorter the spiral flow, measured in a specially designed test mold, the less likely that a production mold for semiconductor packages will completely fill with plastic when that material batch is used. As molding compounds age in storage, the spiral flow becomes shorter. Spiral flow is measured in inches. [SEMATECH] Also see ram follower.
splatter n		(jargon) a poor resist coat caused by the dripping of chemicals on a wafer during the spin operation. [SEMATECH]
spool piece n		in particle contribution testing, a null component consisting of a straight piece of electropolished tubing and appropriate fittings used in place of the test component to establish the baseline. [SEMATECH]
spot n		on semiconductor wafers, contaminant in the form of a random dried droplet of residue from detergents, solvents, or wax. [SEMI Materials, Vol. 3, Definitions for Semiconductor Materials]
spreading resistance () () n		of a semiconductor, the ratio of the potential drop between a small-area conductive metal probe and a reference point on the semiconductor, to the current through the probe. [ASTM F1241]
sputter n		an operation in which a target material, such as gold or aluminum, is bombarded with argon ions. The displaced molecules of the target material are then deposited on the wafer surface. [SEMATECH]
sputter deposition		see sputter.
sputter etch n		the removal of film from a surface by ion bombardment. [SEMATECH]
squareness n		1 : in lithography, a measure of the degree to which an array conforms to an outline of a rectangle or square when four properly chosen corners of the array are compared to the outline. [ASTM F127-84] 2 : in flat panel display substrates, the deviation of the outline of the substrate from a true square or rectangle. [SEMI D9-94]
SRC		see Semiconductor Research Corporation.
SSA		see Semiconductor Safety Association.
SSI		see small scale integration.
SSQA		see Standardized Supplier Quality Assessment.
stability n		the absence of special causes of variation; the property of being in statistical control. [EIA 557]
stable process n		a process that is in statistical control. [EIA 557]
stacked capacitors n		multilayer capacitors for high-density integrated circuits. [SEMATECH]
stacking fault n		in a crystal, a two-dimensional defect caused by a deviation from the normal stacking sequence of atoms. [ASTM F1241]
stack-level abatement n		an end-of-pipe treatment for both corrosive and organic fab emissions that occurs before abatement by other means, such as water scrubbing or thermal destruction. [SEMATECH]
stage micrometer n		a calibrated scale for length measurement in conjunction with a microscope. [ASTM F1241]
stain n		1 : a solution applied to a cross-sectioned silicon device to reveal the location of various structures. [SEMATECH] 2 : contaminant in the form of streaks that are chemical in nature and cannot be removed except through further lapping or polishing. Examples are "white" stains that are seen after chemical etching as white or brown streaks. [SEMI Materials, Vol. 3, Definitions for Semiconductor Materials] 3 : a two-dimensional, contaminating foreign substance on a component surface. [SEMATECH] Also see contamination and foreign material. 4 : in flat panel display substrates, any erosion of the surface; generally cloudy in appearance, it sometimes exhibits apparent color. [SEMI D9-94] 5 : area contamination that is chemical in nature and cannot be removed except through further lapping or polishing. [ASTM F1241]
standard n		a method, rule, or description subscribed to by the consensus of the appropriate industry and under control of the issuing organization for document revision. [SEMATECH]
standard cell n		a small group of transistors that implement a logic function; used as a building block to reduce the magnitude of a design task. [SEMATECH]
standard coordinates n		in the measurement of photolithographic instruments, a system of Cartesian coordinates with the Z axis along the optical axis of the system and with the X and Y axes in the flat plane perpendicular to the optical axis. The system user or vendor will specify the X and Y directions in this plane for any particular equipment studies. [SEMI P25-94]
standard deviation n		1 : a measure of the spread of the process output or the spread of a sampling statistic from the process. The true standard deviation (represented by the Greek letter sigma) is estimated by calculating the difference of each individual observation from the average of the observations, squaring the differences, finding the sum of the squares, dividing by one less than the number of observations, and finding the square root of the result. 2 : a measure of the variation among the members of a statistical sample. [SEMATECH] 3 : in the pressure testing of fluorocarbon tube fittings, a measure of the variation among the members of a statistical sample. [SEMI F8-92]
Standardized Supplier Quality Assessment (SSQA) n		the de facto industry standard process for evaluating an organization's quality systems, business systems, organizational capability, and software quality. [SEMATECH]
standardized test hardware n		automated test equipment (ATE) components that perform with the same specifications, independent of the test system manufacturer. [1994 National Technology Roadmap for Semiconductors]
standardized test software n		a test programming language that allows migration of test programs between automated test equipment (ATE) produced by different manufacturers. [1994 National Technology Roadmap for Semiconductors]
standardized test methodologies n		techniques for testing integrated circuits that have been agreed on by the integrated circuit manufacturers. [1994 National Technology Roadmap for Semiconductors]
standardized tester metrics n		techniques for measuring test system performance through specifications that have been agreed on by test system manufacturers and users. [1994 National Technology Roadmap for Semiconductors]
standard leak rate n		1 : in gas distribution systems, the quantity of test gas at 21.1 degrees C (70 degrees F) and 101.3 kPa (1 atm) flowing through a leak when the partial pressure of test gas on the high pressure side is 101.3 kPa, and the pressure on the low pressure side is below 2 Pa (2 S 10-4 torr). [SEMATECH] 2 : in mass flow controllers, the quantity of helium at 25 degrees C and 101.3 kPa (760 torr) flowing through a leak when the high pressure side is at 101.32 kPa and the low pressure side is below 100 Pa (approximately 1 torr). [SEMI E16-90]
standard pressure n		in the calibration of mass flow devices, the pressure, in pascals, specified as a reference for measurement and comparison. In the semiconductor industry, this pressure is defined as 101.32 kPa (760 torr). [SEMI E29-93]
standard reference material		see artifact.
standard solution n		in the ionic contamination testing of semiconductor leadframes, a solution that contains a known concentration of the ion to be measured, and that is used to calibrate the chromatograph. [SEMI G59-94]
standard temperature n		1 : defined as 21 degrees C ± 5 degrees C (70 degrees F ± 10 degrees F). [SEMI F4-90] 2 : in the calibration of mass flow devices, the temperature, in degrees Celsius, specified as a reference for measurement and comparison. In the semiconductor industry, this temperature is defined as 0.0 degrees C. [SEMI E29-93]
standard volumetric flow n		in mass flow controllers, the calculated volumetric flow, at standard temperature and pressure, of gas in a closed fluid channel. Volume at standard temperature and pressure follows the ideal gas law, PV=nRT. Units of standard volumetric flow are commonly used to express mass flow in mass flow controllers and meters. Also see mass flow of gas, standard temperature, standard pressure, mass flow controller, and mass flow meter. [SEMI E29-93]
standby state n		one of the six equipment states or conditions; a period other than nonscheduled time, in which the equipment is not operated, although it is in a condition to perform its intended function, and the chemicals and facilities are available. [SEMI E10-92]
standby time n		the total time (other than nonscheduled time) during which equipment is not operated, although it is in a condition to perform its intended function, and the chemicals and facilities are available. [SEMI E10-92] Also see standby state.
standoff n		1 : the feature on the pins or leads which keeps the body of a dual inline or pin grid array semiconductor package from contacting the surface of a printed circuit board to which the leads are soldered. [SEMATECH] 2 : the distance that the body of a semiconductor package is held off the circuit board to which the package leads are soldered. [SEMATECH] Also see seating plane. 3 : standoff features, such as raised plastic areas; these may also be designed into the body of plastic packages. [SEMATECH]
starburst n		a poor resist coat caused by the application of a deficient amount of resist during the spin operation; results in a radial starburst pattern. [SEMATECH]
start/stop character pattern n		in the bar code marking of silicon wafers, a special bar code character that provides the scanner with start and stop reading instructions, as well as scanning direction. The start character is at the left end of a BC-412 symbol, and the stop character is at the right end of the symbol. [SEMI T1-93]
start-up n		the time required for equipment to achieve a condition in which it can perform its intended function when leaving a nonscheduled state. It includes pumpdown, warm-up, cool-down, stabilization periods, and initialization routines. Startup is included only in nonscheduled time. [SEMI E10-92]
state n		in equipment communications, a static set of conditions and associated behavior. While all of its conditions are met, the state is current (active). Behavior within a given state includes the response to various stimuli. [SEMI 2314, proposed]
state model n		in computer-integrated manufacturing (CIM), the definition of the legal or stable conditions in which a system application or an object may exist, the transitions that can lead from state to state, and the events that cause these transitions to occur. [SEMATECH]
static current test () n		quiescent power supply current; a test that measures power supply leakage current in a complementary metal-oxide semiconductor (CMOS) integrated circuit to determine whether excess current flows, implying a fault. [1994 National Technology Roadmap for Semiconductors]
static port n		in automated material movement, a port with no associated mechanisms capable of assisting or interfering with the transfer of an object. A transfer partner utilizing a static port for the transfer should always be passive. [SEMI E32-94] Contrast dynamic port.
static pressure (SP) n		in equipment exhaust systems, the measure of differential pressure across the duct wall to the ambient pressure (inside the duct). The unit of measure is pascals (Pa, Newtons per square meter [N/m 2]) or inches of water. [SEMI S6-93]
static test n		in particle contribution testing, a test performed on an as-received component in the fully open position. This test establishes particulate contribution by the valve to the counting system. [SEMATECH]
station n		a given collection of input and output devices, regardless of type. However, a large majority of stations in the manufacturing environment consist primarily of a CRT display and keyboard with other optional devices. An increasingly popular alternative is a station based on personal computer technology. [SEMATECH]
statistical process control (SPC) n		the use of statistical methods to analyze a process or its output to take appropriate actions to achieve and maintain a state of statistical control and continuously improve the process capability. [EIA 557]

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