3D Interconnects: Meet the experts
SEMATECH's 3D Program is led by a strong team of diverse talents with experience in key areas needed to make manufacturable 3D interconnects a reality.
Sitaram R. Arkalgud, Ph.D., is the director of SEMATECH’s 3D Interconnect Program. Arkalgud has directed SEMATECH’s Interconnect division for three years while on assignment to SEMATECH from Qimonda/Infineon Technologies. Prior to his assignment at SEMATECH, he was Infineon’s Director of the MRAM Development Alliance between Infineon and IBM, and worked as a technology officer for the Memory Products Division and product manager for Ferroelectric RAM. Previously, he was at Motorola, working for nine years in several advanced logic and memory projects. He holds a doctorate and master’s degree in materials engineering from Rensselaer Polytechnic Institute, and a bachelor’s degree in metallurgical engineering from Karnataka Regional Engineering College, Suratkal, India. He is author of many publications and presentations, and holder of 14 patents.
Larry Smith, Ph.D., is a Member of the Technical Staff, responsible for 3D cost and yield modeling and reliability. He previously worked on copper low-k reliability and process integration. Prior to joining SEMATECH, he worked on high density interconnect for packaging applications, managing the design group for thin-film-on-laminate BGA substrates at Kulicke & Soffa, and managing programs on multi-chip packaging at MicroModule Systems, Dell Computer, and MCC. He received his Ph.D from the University of Illinois-Urbana.