3D Interconnects: Meet the experts
SEMATECH's 3D Program is led by a strong team of diverse talents with experience in key areas needed to make manufacturable 3D interconnects a reality.
Larry Smith, Ph.D., is a Member of the Technical Staff, responsible for 3D cost and yield modeling and reliability. He previously worked on copper low-k reliability and process integration. Prior to joining SEMATECH, he worked on high density interconnect for packaging applications, managing the design group for thin-film-on-laminate BGA substrates at Kulicke & Soffa, and managing programs on multi-chip packaging at MicroModule Systems, Dell Computer, and MCC. He received his Ph.D from the University of Illinois-Urbana.