3D Interconnects—Through Silicon Vias (TSVs)
SET FC300 Die Bonder
The SET FC300 Die Bonder is a high-precision die bonding tool that is being used to explore advanced bonding processes at SEMATECH. It is capable of both die-to-die and die-to-wafer bonding and can populate wafers up to 300 mm in diameter. Additional upgrades for this tool include automated adhesive dispensing, ultrasonic bonding, and formic acid process gas for copper bonding.