As a semiconductor industry leader, SEMATECH embraces its responsibility to extend existing lithography technologies for as long as possible, while developing next-generation solutions and investigating alternative approaches.
We also stress continued improvement and evolution in lithography infrastructure. This focus is grounded in real-world manufacturing feasibility and cost of ownership (COO)—a characteristic of all SEMATECH programs.
Extreme ultraviolet lithography (EUVL) is an advanced form of lithography that uses extremely short wavelength (13.5 nm) light, mirrors and reflective photomasks to image circuit patterns onto the surface of semiconductor wafers. The microchips that are produced with EUV technology contain features 32 nm wide or smaller, and are projected to be as much as 100 times faster, with 1,000 times the memory capacity of today's most powerful computer chips.
SEMATECH’s vision is to deliver key capability that will enable EUV mask blanks with linewidths of 22 nm and below, while providing imaging capability to test resists at the same dimensions; and drive defect-free reticle carriers to commercialization.
Our supporting programs include:
AZ Electronic Materials
Dow Electronic Materials
JSR Micro Corporation
Nissan Chemical Industries
Shin-Etsu Chemical Co.
Sumitomo Chemical Co.